Fabrication of front surface matched ultrasonic transducer array

• US 4,217,684 A
• Filed: 04/16/1979
• Issued: 08/19/1980
• Est. Priority Date: 04/16/1979
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Brisken, Axel F., Smith, Lowell S.
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US06/030,299
• Time in Patent Office: 491 Days
• Field of Search: 29/25.35, 29/628, 29/418, 310/334, 310/367, 310/327, 128/660
• US Class Current: 29/25.35
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: G10K 11/02 Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding

Abstract

A slab of piezoelectric ceramic plated on all surfaces is bonded to quarter wavelength impedance matching layers of glass and plastic. The top surface of the ceramic is slotted and parallel cuts orthogonal to the slots are made through the ceramic and into the glass to delineate an array of elements each with a signal electrode between slots and a wrap-around ground electrode. After making ground connections and flying lead connections to the signal electrodes, the matching layers are fully cut through from the front. A covering or wear plate is attached to the front surface and a relatively large mass of acoustic damping material covers the backs of the elements.

Claims

1. The method of assembling a front surface matched ultrasonic transducer array operative to generate ultrasound pulses at an emission frequency and to detect echoes comprising the steps of:

plating with metal at least the major surfaces and two side edges of a rectangular slab of piezoelectric ceramic having a thickness of one-half wavelength at the emission frequency, and bonding to the plated ceramic at least one impedance matching layer having a thickness of one-quarter wavelength at the emission frequency,

cutting slots in the plated ceramic near the side edges such that the distance between slots is equal to a designated element radiative length,

making first cuts parallel to the end edges of the plated ceramic at a spacing equal to a designated element width and which extend completely through the ceramic and partially into the matching layer to thereby delineate an array of elements each having a signal electrode and a wrap-around ground electrode,

fabricating a flying lead connection to the signal electrode of every element and a common connection to the ground electrodes,

making second cuts through the remainder of the matching layer which are aligned with the first cuts to completely separate the bonded together element and matching layer units, and

attaching a continuous covering to the front surface of the matching layer.

2. The method of claim 1 and the additional step of depositing a relatively large mass of acoustically lossy material to cover the backs of the elements, said material having an acoustic impedance that is low compared to that of the piezoelectric ceramic.

3. The method of claim 1 wherein the step of fabricating flying lead signal connections and ground electrode connections is performed by bonding a ground plane printed circuit board to the matching layer and making a connection between every ground electrode and a common bus conductive pattern on the ground plane board, mounting a signal printed circuit board to be supported by the ground plane board and project over the elements, connecting a flying lead between every signal electrode and a conductive pattern on said signal board, and connecting the common ground bus to a conductive pattern on said signal board.

4. The method of claim 3 wherein the signal board projects over the elements from both sides and has a beveled surface facing the elements, and the additional step of filling at least the space between the elements and signal board with an acoustically lossy material.

5. The method of claim 4 and the additional step of trimming off opposing sides of the assembly to reduce the overall dimension in the direction of the length of the elements.

6. The method of claim 4 and the additional steps of mounting a connector package above the signal board and connecting wires between the signal board conductive patterns and said connector, and filling in at least a substantial part of the space between the signal board and connector package with said acoustically lossy material.

7. The method of claim 3 wherein the signal board projects over the elements from both sides and the additional step of securing a cap to the signal board which covers the signal flying leads.

8. The method of claim 1 wherein the step of fabricating flying lead signal connections and ground electrode connections is performed by bonding a ground plane printed circuit board to the matching layer and depositing a conductive filler to electrically connect every ground electrode to a common bus conductive pattern on the ground plane board, mounting a signal printed circuit board to be supported by the ground plane board and project over the elements from both sides, ultrasonically bonding a flying lead between every signal electrode and conductive patterns on the signal board, connecting a ground wire between the ground plane common bus and a signal board conductive pattern, and depositing epoxy to at least fill the space between the backs of the elements and said signal board, said epoxy having an acoustic impedance that is low compared to that of the piezoelectric ceramic.

9. The method of claim 8 and the additional step of trimming the assembly to reduce the overall dimension in the direction of the length of the elements.

10. The method of assembling a front matched surface ultrasonic transducer array operative to generate ultrasound pulses at an emission frequency and to detect echoes comprising the steps of:

plating with metal all the surfaces of a rectangular slab of piezoelectric ceramic having a thickness of one half wavelength at the emission frequency, and bonding to the plated ceramic and to one another first and second impedance matching layers each having a thickness of one-quarter wavelength at the emission frequency,

cutting two slots in the plated ceramic parallel to the side edges such that the distance between slots is equal to a designated element radiative length,

making first cuts parallel to the end edges of the plated ceramic at a spacing equal to a designated element width and which extend completely through the ceramic and partially into one matching layer to thereby delineate a separate signal electrode on each element and a wrap-around ground electrode on each element,

bonding a ground plane printed circuit board to the first matching layer and depositing conductive filler material to electrically connect every ground electrode and a common bus conductive pattern on the ground plane board,

supporting a signal printed circuit board on said ground plane board so as to project over the elements from both sides and providing a flying lead electrical connection between every signal electrode and conductive patterns on the signal board and also a ground wire connecting the ground plane board conductive pattern to a signal board conductive pattern,

making second cuts through the matching layers which are aligned with the first cuts to completely separate the bonded together element and matching layer units, and

attaching a continuous covering to the front surface of the matching layers.

11. The method of claim 10 and the step of filling at least the space between the backs of the elements and said signal board with an acoustically lossy material which has a low acoustic impedance as compared to that of the piezoelectric ceramic.

12. The method of claim 11 and the step of mounting a connector package above the signal board and connecting wires between the signal board conductive patterns and said connector, and filling at least a substantial portion of the space between said signal board and connector package with said acoustically lossy material.