Pressure transducer

• US 4,321,578 A
• Filed: 10/03/1979
• Issued: 03/23/1982
• Est. Priority Date: 10/06/1978
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Uchida, Hiroyasu, Nagata, Takeo, Sakurai, Yutaka, Nagasu, Akira, Yamamoto, Yosimi
• Primary Examiner(s): Albritton, C. L.
• Application Number:
  US06/081,372
• Time in Patent Office: 902 Days
• Field of Search: 338/4, 338/42, 73/719, 73/720, 73/725, 73/726, 73/715
• US Class Current: 338/42
• CPC Class Codes: G01L 13/025 using diaphragms
• CPC Class Codes: G01L 19/0038 being part of the housing other details about the housing G01L19/14
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection

Abstract

A pressure transducer is arranged to mount a semiconductor pressure sensor in a housing such that the pressure of a high-pressure fluid is applied to one side of the semiconductor pressure sensor through a high pressure seal diaphragm and a sealed liquid in the high pressure side, while the pressure of a low-pressure fluid is applied to the other side of the sensor through a low-pressure seal diaphragm and a sealed liquid in the low pressure side, and a protecting member is provided closer to the low-pressure seal diaphragm.

Claims

1. A pressure transducer comprising:

a housing;

a semiconductor pressure sensor mounted in said housing;

high-pressure side and low-pressure side flanges fixed to said housing so as to define a high-pressure side space between said high-pressure side flange and one surface of said sensor and a low-pressure side space between said low-pressure side flange and the opposite surface of said sensor, respectively;

a high-pressure seal diaphragm provided in said high-pressure side space to divide said space into a first space to which said one surface of said sensor is exposed and a second space in which a high-pressure fluid is introduced;

a high-pressure side sealed liquid filled in said first space;

means for mounting said high-pressure seal diaphragm such that said high-pressure sealed liquid receives a pressure substantially the same as the pressure of said high-pressure fluid introduced into said second space through said high-pressure seal diaphragm at least until said pressure of said high-pressure fluid exceeds a pressure value at which said semiconductor pressure sensor may be broken;

a low-pressure seal diaphragm provided in said low-pressure side space to separate it into a third space to which said opposite surface of said sensor is exposed and a fourth space in which atmosphere is introduced;

a low-pressure side sealed liquid filled in said third space; and

a protective member provided in said fourth space and disposed to be normally spaced from said low-pressure seal diaphragm by an amount equal to the maximum permissible deflection of said low-pressure seal diaphragm in response to a high pressure so as to protect said low-pressure seal diaphragm against the force of said high-pressure fluid when said sensor and said high-pressure seal diaphragm are accidentally destroyed by the pressure applied thereto.

3. A pressure transducer according to claim 1, in which said protective member is a disc like protuberant member formed on a surface of said low-pressure flange facing said low-pressure seal diaphragm and having a diameter slightly larger than that of said low pressure seal diaphragm.

4. A pressure transducer according to claim 1, wherein said protective member is an annular projection formed on a surface of said low-pressure flange facing said low-pressure seal diaphragm and having a diameter slightly smaller than that of the said low-pressure seal diaphragm.

5. A pressure transducer according to claim 1, wherein said protective member is provided on said low-pressure side flange.

2. A pressure transducer comprising:

a housing defining a pressure measuring chamber which is opened at each of opposing sides of said housing;

a hollow retaining member mounted in said pressure measuring chamber and having a hollow portion extending between said opposing sides of said housing;

a semiconducor pressure sensor mounted to said retaining member so as to cover one end of said hollow portion,

a high-pressure seal diaphragm mounted to said housing to define a closed first space to which one surface of said sensor is exposed;

a high-pressure side sealed liquid filled in said first space;

a high-pressure flange fixed to said housing so as to define a second space separated from said first space by said high-pressure seal diaphragm and having a passage for introducing a high pressure fluid into said second space;

means for mounting said high-pressure seal diaphragm such that said high-pressure sealed liquid receives a pressure substantially the same as the pressure of said high-pressure fluid introduced into said second space through said high-pressure seal diaphragm at least until said pressure of said high-pressure fluid exceeds a pressure value at which said semiconductor pressure sensor may be broken;

a low-pressure seal diaphragm mounted to said housing to define a closed third space to which the other surface of said sensor is exposed;

a low-pressure side sealed liquid filled in said third space;

a low-pressure flange fixed to said housing so as to define a fourth space separated from said third space by said low-pressure seal diaphragm and having a passage for introducing atmosphere into said fourth space;

a protective member provided in said fourth space and disposed to be normally spaced from said low-pressure seal diaphragm by an amount equal to the maximum permissible deflection of said low-pressure seal diaphragm in response to a high pressure so as to protect said low-pressure seal diaphragm against the force of said high-pressure fluid when said sensor and said high-pressure seal diaphragm are accidentally destroyed by the pressure applied thereto.

6. A pressure transducer according to claim 2, in which said retaining member includes a first portion made of an iron-nickel alloy and a second portion made of glass and fixed to said first portion, said first portion being bonded to said housing and said second portion being bonded to said semiconducor pressure sensor.