Batch chip placement system

  • US 4,342,090 A
  • Filed: 06/27/1980
  • Issued: 07/27/1982
  • Est. Priority Date: 06/27/1980
  • Status: Expired due to Term
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First Claim
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1. A batch component placement system for the batch positioning of components at pre-assigned sites upon a substrate where the sites vary in position from substrate to substrate, comprising:

  • substrate means having pre-assigned sites including at least one pair of alignment marks thereon;

    optical means for locating the actual position of said pair of alignment marks on said substrate means;

    means to compare the actual position of said pair of alignment marks with the theoretical position of said marks to determine the amount of misalignment;

    a plurality of component locator means, each one of which is arranged to align and locate a component thereon;

    means to position components on each of said plurality of component locator means;

    means to individually position each of said plurality of component locator means in accordance with said amount of misalignment; and

    component pickup means to remove said components from each of said plurality of component locator means and position same at said pre-assigned sites upon said substrate means.

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