Method of manufacturing a semiconductor device

• US 4,352,724 A
• Filed: 11/19/1980
• Issued: 10/05/1982
• Est. Priority Date: 11/28/1979
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Sugishima, Kenji, Takada, Tadakazu
• Primary Examiner(s): Weisstuch, Aaron
• Application Number:
  US06/208,391
• Time in Patent Office: 685 Days
• Field of Search: 204/192 E, 156/643, 156/651
• US Class Current: 204/192.37
• CPC Class Codes: H01L 21/033 comprising inorganic layers
• CPC Class Codes: H01L 21/0332 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/0334 characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
• CPC Class Codes: H01L 21/0335 characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/31111 by chemical means
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/32134 by liquid etching only
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 21/32137 of silicon-containing layers
• CPC Class Codes: H01L 21/76804 by forming tapered via holes
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213

Abstract

A method of manufacturing a semiconductor device having a multi-layer structure comprises the steps of patterning in accordance with a predetermined pattern a thin film of photoresist formed on a film to be etched which has been formed on a semiconductor substrate, etching the film to be etched partly by an isotropic etching using said patterned film as a mask, completing the etching by an anisotropic etching in the direction of its depth, resulting in tapered or inclined sides on the etched film. The isotropic and anisotropic etchings may be carried out in the same apparatus by changing the reactive gases used in these etchings and/or the conditions of each etching, such as the amount of gas, the gas pressure and the applied radio frequency power.

Claims

1. A method of manufacturing a semiconductor device with a multi-layer structure on a semiconductor substrate to have a more uniform thickness of at least one of the layers, said method comprising the steps of

forming a masking film with a predetermined pattern on a selected one of said layers that is to be etched in forming said multi-layer structure,

isotropically etching each portion of said layer exposed by said pattern to a substantial depth of said selected layer with a respective etchant, leaving at least a lower part of each said exposed portion of said selected layer, said isotropic etching resulting in the removal of at least some of said selected layer underneath said masking film at the edges of said predetermined pattern, and

completing removal of said selected layer in an area of each said lower part by anisotropic etching so that the lower surface of said selected layer has said predetermined pattern,

wherein the combination of said etchings result in the selected layer having said predetermined pattern with tapered edges.

2. The method of claim 1, wherein said selected layer is aluminum or an aluminum alloy, said isotropic etching comprises a wet etching using a solution of H₃ PO₄, and said anisotropic etching is a dry etching with a reactive gas chosen from a chloride compound gas, a mixture of at least any two of said chloride compound gases, a mixture of any of said chloride compound gases and mixtures mixed with O₂ or CF₄, or any of said gases or mixtures mixed with an inactive gas, and said anisotropic etching is conducted in a planar type plasma etching apparatus.

3. The method of claim 2, said inactive gas comprising at least one gas selected from the group consisting of Ar and He.

4. The method of claim 1, said selected layer comprising at least two sub-layers, each sub-layer being of a different material, and each sub-layer having a higher etching rate in said reactive gas than the next-lowest sub-layer.

5. The method of claim 4, said selected layer consisting of two of said sub-layers, the upper sub-layer being Si₃ N₄ and the lower sub-layer being SiO₂.

6. The method of claim 1, said isotropic etching comprising wet etching.

7. The method of claim 6, wherein said selected layer is single crystalline or polycrystalline silicon and said respective etchant is selected from the HF-HNO₃ family.

8. The method of claim 6, wherein said selected layer is SiO₂ or PSG, and said respective etchant is selected from the HF-H₂ O family.

9. The method of claim 6, wherein said selected layer comprises aluminum, and said respective etchant is selected from the H₃ PO₄ -HNO₃ family.

10. The method of claim 1, said isotropic etching comprising a barrel type plasma etching.

11. The method of claim 10, wherein said selected layer is single crystal silicon, polycrystalline silicon, or SiO₂ and said respective etchant is CF₄, CF₄ +O₂, or CF₃ Cl+O₂.

12. The method of claim 10, said selected layer comprising Si₃ N₄, and said respective etchant is CF₄, CF₄ +O₂, or SiF₄.

13. The method of claim 10, said selected layer comprising PSG, and said respective etchant is CF₄, CF₄ +O₂, or CClF₃ +O₂.

14. The method of claim 1, said isotropic etching comprising a planar type plasma etching.

15. The method of claim 14, wherein said selected layer is single crystal silicon, polycrystalline silicon, SiO₂, Si₃ N₄, or PSG and said respective etchant is C₂ F₅ Cl+CF₄ at a gas pressure of at least 1 Torr, or CF₄ or CF₄ +O₂ at a gas pressure of at least 0.1 Torr.

16. The method of claim 1, said isotropic etching selectively comprising reactive ion etching and reactive sputter etching.

17. The method of claim 16, wherein said selected layer is single crystal silicon, polycrystalline silicon, SiO₂, Si₃ N₄, or PSG and said respective etchant is C₂ F₅ Cl+CF₄ at a gas pressure of at least 0.1 Torr, or CF₄ or CF₄ +O₂ at a gas pressure of at least 0.01 Torr.

18. The method of claim 1, said anisotropic etching selectively comprising reactive ion etching and reactive sputter etching.

19. The method of claim 18, wherein said selected layer is Si₃ N₄, single crystal silicon or polycrystalline silicon, and wherein said reactive gas is:

a chloride compound gas;

CF₄ or CF₄ +O₂ at a maximum gas pressure of 0.02 Torr;

C₂ F₅ Cl or C₂ F₅ Cl+CF₄ at a maximum gas pressure of 0.1 Torr;

a gas mixture of at least one chloride compound gas mixed with O₂ or CF₄ ;

a gas mixture of any two chloride compound gases;

a gas mixture of at least one of said chloride compound gases or mixtures mixed with O₂ or CF₄ ;

or C₂ F₆.

20. The method of claim 19, wherein each said chloride compound gas is CCl₄, PCl₃, BCl₃ or SiCl₄.

21. The method of claim 18, wherein the material of said selected layer is PSG, Si₃ N₄ or SiO₂, and wherein said reactive gas is:

CF₄ or CF₄ +O₂ at a maximum gas pressure of 0.02 Torr;

CF₄ +H₂, CHF₃, C₂ F₆, C₃ F₈, or C₄ F₈.

22. The method of claim 18, wherein the material of said selected layer is aluminum or aluminum alloy, and wherein said reactive gas is:

a chloride compound gas;

a gas mixture of at least two of said chloride compound gases;

a gas mixture of at least one of said chloride compound gases with O₂ or CF₄ ;

or

a gas mixture of any of said gases and mixtures with an inactive gas.

23. The method of claim 1, 10, 14, 16, or 18, both said isotropic and anisotropic etching comprising a dry etching process with a respective reactive gas, both said isotropic and anisotropic etchings comprising applying radio frequency power to said reactive gases, said method comprising performing said isotropic and anisotropic etchings in the same dry etching apparatus by selecting the respective reactive gases and the conditions of each said etching, including the amount and pressure of each said gas in each said etching.

24. The method of claim 23, wherein said selected layer is single crystal silicon, polycrystalline silicon, or Si₃ N₄, said reactive gas of said isotropic etching is CF₄, CF₄ +O₂ or C₂ F₅ Cl+CF₄, and said reactive gas of said anisotropic etching is a chloride compound gas, CF₄, CF₄ +O₂, a mixture of at least one chloride compound gas with O₂ or CF₄, a mixture of at least two chloride compound gases, any of said gas mixtures mixed with O₂ or CF₄, or C₂ F₆.

25. The method of claim 24, wherein said chloride compound gas is CCl₄, PCl₃, BCl₃, SiCl₄, or C₂ F₅ Cl, and said chloride compound mixture with O₂ comprises 5% O₂.

26. The method of claim 23, wherein said apparatus comprises a planar type plasma etching apparatus, said selected layer is of phospho-silicate-glass, Si₃ N₄ or chemically vapor deposited or thermally grown SiO₂, said reactive gas of said isotropic etching is C₂ F₅ Cl+CF₄, CF₄ or CF₄ +O₂, and the reactive gas for said anisotropic etching is CF₄, CF₄ +O₂, CF₄ +H₂, CHF₃, C₂ F₆, C₃ F₈ or C₄ F₈.

27. The method of claim 1, 6, 10, 14 or 16, said anisotropic etching comprising a planar type plasma etching.

28. The method of claim 27, wherein said selected layer is Si₃ N₄, single crystal silicon, or polycrystalline silicon, and said reactive gas is:

a chloride compound gas;

CF₄ or CF₄ +O₂ at a maximum gas pressure of 0.2 Torr;

C₂ F₅ Cl or C₂ F₅ Cl+CF₄ at a maximum gas pressure of 1 Torr;

a gas mixture of any of said chloride compound gases with O₂ or CF₄ ;

a gas mixture of at least two of said chloride compound gases;

a gas mixture of any of said gases and mixtures with O₂ or CF₄ ;

or C₂ F₆.

29. The method of claim 28, wherein each said chloride compound gas is CCl₄, PCl₃, BCl₃, or SiCl₄.

30. The method of claim 27, wherein said selected layer is PSG, Si₃ N₄ or SiO₂, and wherein said reactive gas is:

CF₄ or CF₄ +O₂ at a gas pressure of at least 0.1 Torr;

CF₄ +H₂, CHF₃, C₂ F₆, C₃ F₈, or C₄ F₈.

31. The method of claim 27, wherein the material of said selected layer is aluminum or an aluminum alloy, and wherein said reactive gas is:

a chloride compound gas;

a gas mixture of at least two chloride compound gases;

a gas mixture of any of said gases and mixtures with O₂ or CF₄ ;

or

a gas mixture of any of said gases and mixtures with an inactive gas.

32. The method of claim 31, wherein each said chloride compound gas is CCl₄, PCl₃ or BCl₃.

33. The method of claim 31, wherein said aluminum alloy is Al-Cu, Al-Si or Al-Cu-Si.

34. The method of claim 22, said isotropic and anisotropic etching comprising a dry etching process with a respective reactive gas, both said isotropic and anisotropic etchings comprising applying radio frequency power to said reactive gases, said method comprising performing said isotropic and anisotropic etchings in the same dry etching apparatus by selecting the respective reactive gases and the conditions of each said etching, including the amount and pressure of each said gas in each said etching.

35. The method of claim 2 or 22 wherein each said chloride compound gas is CCl₄, PCl₃ or BCl₃.

36. The method of claim 2 or 22 wherein said aluminum alloy is Al-Cu, Al-Si or Al-Cu-Si.