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Method for fabricating a semiconductor device

  • US 4,352,834 A
  • Filed: 12/04/1980
  • Issued: 10/05/1982
  • Est. Priority Date: 12/26/1979
  • Status: Expired due to Term
First Claim
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1. A method for depositing a film onto a substrate utilizing evaporation comprising the steps offorming an atmosphere containing an atomic state gas selected from a group consisting of hydrogen, oxygen and nitrogen with a partial pressure of 1×

  • 10-3 Torr or less, in a vacuum container, anddepositing a film consisting of a compound presenting semiconductor characteristics or a solid solution thereof on a substrate in said atmosphere to form a film on said substrate.

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