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Magnetron cathode sputtering apparatus

  • US 4,356,073 A
  • Filed: 02/12/1981
  • Issued: 10/26/1982
  • Est. Priority Date: 02/12/1981
  • Status: Expired due to Term
First Claim
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1. A method of sputtering thin films of a selected coating material upon substantially planar substrates, in which there is provided an evacuated coating chamber enclosing an elongated, cylindrical tubular member having a layer of the coating material to be sputtered applied to the outer surface thereof, establishing within said tubular member a magnetic field to provide an erosion zone on the coating material extending substantially the entire length of the tubular member and circumferentially along a relatively narrow region thereof, rotating said tubular member about its longitudinal axis to bring different portions of the coating material into sputtering position opposite the magnetic field, and moving the substantially planar substrates horizontally beneath said erosion zone in a linear path to receive the sputtered material.

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