Magnetron cathode sputtering apparatus
First Claim
1. A method of sputtering thin films of a selected coating material upon substantially planar substrates, in which there is provided an evacuated coating chamber enclosing an elongated, cylindrical tubular member having a layer of the coating material to be sputtered applied to the outer surface thereof, establishing within said tubular member a magnetic field to provide an erosion zone on the coating material extending substantially the entire length of the tubular member and circumferentially along a relatively narrow region thereof, rotating said tubular member about its longitudinal axis to bring different portions of the coating material into sputtering position opposite the magnetic field, and moving the substantially planar substrates horizontally beneath said erosion zone in a linear path to receive the sputtered material.
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Accused Products
Abstract
A rotatable magnetron cathode sputtering apparatus for operation within an evacuable chamber for coating substrates that are also contained within said chamber. The cathode comprises an elongated cylindrical tube having a layer of the coating material or materials to be sputtered applied to the outer surface thereof. Magnetic means is mounted within the tube and includes at least one row of permanent U-shaped magnets extending lengthwise of the tube. The tube is horizontally disposed and rotatably mounted in the coating chamber such that it can be turned on its longitudinal axis relative to the magnets to selectively bring different portions or segments of the same sputtering material or different sputtering materials into sputtering position with respect to the magnets and within the magnetic field. Means is also provided for internally cooling the cathode.
180 Citations
12 Claims
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1. A method of sputtering thin films of a selected coating material upon substantially planar substrates, in which there is provided an evacuated coating chamber enclosing an elongated, cylindrical tubular member having a layer of the coating material to be sputtered applied to the outer surface thereof, establishing within said tubular member a magnetic field to provide an erosion zone on the coating material extending substantially the entire length of the tubular member and circumferentially along a relatively narrow region thereof, rotating said tubular member about its longitudinal axis to bring different portions of the coating material into sputtering position opposite the magnetic field, and moving the substantially planar substrates horizontally beneath said erosion zone in a linear path to receive the sputtered material.
- 2. In apparatus for sputtering thin films of a selected coating material upon substantially planar substrates, an evacuable coating chamber, a cathode mounted horizontally in said coating chamber comprising an elongated, cylindrical tubular member having a layer of the coating material to be sputtered applied to the outer surface thereof, magnetic means located in said tubular member for providing a sputter zone extending substantially the entire length of the tubular member and circumferentially along a relatively narrow region thereof, means for rotating said tubular member about its longitudinal axis to bring different portions of the coating material into sputtering position opposite said magnetic means and within said sputter zone, and means in the coating chamber for supporting the substantially planar substrates horizontally and for transporting them in a linear path beneath the magnetic means to receive the sputtered material.
Specification