Apparatus for mounting chip type circuit elements on printed circuit boards

• US 4,372,802 A
• Filed: 05/21/1981
• Issued: 02/08/1983
• Est. Priority Date: 06/02/1980
• Status: Expired due to Fees

• Current Assignee: Yutaka Otoshi
• Original Assignee: Tokyo Denki Kagaku Kogyo Kabushiki Kaisha (TDK Corporation)
• Inventors: Takahashi, Kenichi, Harigane, Kotaro, Tando, Shuichi, Shudo, Hirokazu
• Primary Examiner(s): Weston, Caleb
• Application Number:
  US06/266,109
• Time in Patent Office: 628 Days
• Field of Search: 156/538, 156/539, 156/556, 156/566, 156/567, 156/584, 29/740, 29/743, 29/809, 29/729, 29/738, 29/759, 29/799, 221/211, 221/210, 414/103, 414/104, 414/110, 414/223, 414/226, 414/750, 414/752
• US Class Current: 156/538
• CPC Class Codes: H05K 13/021 Loading or unloading of containers H05K13/028 takes precedence
• CPC Class Codes: H05K 13/0409 Sucking devices
• CPC Class Codes: H05K 13/041 having multiple pick-up tools
• CPC Class Codes: H05K 13/0434 with containers
• CPC Class Codes: Y10S 156/942 with reorientation means
• CPC Class Codes: Y10T 156/17 Surface bonding means and/or assemblymeans with work feeding or handling means
• CPC Class Codes: Y10T 156/1702 For plural parts or plural areas of single part
• CPC Class Codes: Y10T 156/1744 Means bringing discrete articles into assembled relationship
• CPC Class Codes: Y10T 156/1768 Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
• CPC Class Codes: Y10T 156/1771 Turret or rotary drum-type conveyor
• CPC Class Codes: Y10T 156/1978 Delaminating bending means
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/5317 Laminated device
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part
• CPC Class Codes: Y10T 29/53261 Means to align and advance work part
• CPC Class Codes: Y10T 29/53435 including assembly pallet

Abstract

Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be connected intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

Claims

1. Apparatus for mounting chip type circuit elements on printed circuit boards, comprising:

supply unit means for supplying chip type circuit elements;

a plurality of pallets and means for conveying said pallets in an intermittent fashion in a particular direction;

sequence head means for shifting said chip type circuit elements from said supply unit means onto said pallets;

an X-Y table and means for conveying printed circuit boards onto said X-Y table;

mounting means including at least one mounting head for mounting said chip type circuit elements on a printed circuit board carried by said X-Y table; and

shifting head means for shifting said chip type circuit elements from said pallets to said at least one mounting head,

whereby upon said sequence head means shifting said circuit elements onto said pallets from said supply unit means, said pallets are conveyed in an intermittent fashion in said particular direction whereupon said shifting head means shifts said circuit elements to said mounting head from said pallets, and whereupon said mounting means mounts said circuit element on a printed circuit board carried by said X-Y table.

2. The combination of claim 1 wherein said supply unit means comprises means for supplying a plurality of chip type circuit elements simultaneously in a substantially linear pattern and spaced from each other by a predetermined pitch, and wherein said sequence head means includes a plurality of suction pin means for picking up respective one of said circuit elements and holding the same during shifting thereof onto said pallets, said suction pin means being arranged in a substantially linear pattern and spaced from each other by said predetermined pitch.

3. The combination of claim 1 wherein said mounting means comprises an indexing disc, means for rotating said indexing disc in an intermittent manner at a predetermined angular pitch, and a plurality of mounting heads radially mounted on said indexing disc and spaced from each other at said predetermined angular pitch.

4. The combination of claim 1 wherein at least one of said sequence and shifting head means includes a suction head, said suction head comprising a supporting block;

a pneumatic cylinder affixed to said supporting block, said pneumatic cylinder including an outer cylinder, a piston slidably received within said outer cylinder for movement between an upper and a lower position, and a suction pin operatively connected to said piston;

a suction port opening in the lower end surface of said suction pin;

a suction bore formed in said outer cylinder for connection to a vacuum source, said suction bore being located so as to communicate with said suction port when the latter is in said lower position.

5. The combination of claim 1 wherein each of said pallets includes an adhesive mat constituting an upwardly facing surface for carrying said chip type circuit elements, and a plurality of lifting pins mounted for reciprocating movement between a lower position wherein an upper end thereof does not project above the surface of said mat and an upper position wherein said upper end projects above the surface of said adhesive mat.

6. The combination of claim 1 wherein said mounting means includes an indexing member, means for rotating said indexing member in an intermittent manner, and a plurality of mounting heads mounted on said indexing member, and wherein each mounting head includes a mounting head shaft mounted for both rotation and for axial sliding movement, actuating means for moving said mounting head shaft in an axial direction, a suction pin mounted on an end of said mounting head shaft and adapted to pick up and hold a chip type circuit element, and gear means for transmitting a rotational torque to said mounting head shaft.

7. The combination of claim 6 further including spring means for biasing said suction pin to a position wherein it projects outwardly from said end of said mounting head shaft.

8. The combination of claim 1 further including means for positioning the chip type circuit elements as the same are held on said mounting head of said mounting means, said positioning means including a first claw having a first notch formed therein defining a substantially orthogonal apex portion, and a second claw having a second notch formed therein defining a substantially orthogonal apex portion, said first and second claws being movably mounted such that said apex portions of said first and second claws are in mutually opposed relationship and situated along a line passing through diagonal corners of a chip type circuit element which is positioned at a desired position.

9. The combination of claim 8 wherein said positioning means further includes first and second racks fixed to said first and second claws respectively, said racks being arranged substantially parallel with respect to each other, and a common pinion in meshing engagement with said racks.

10. Apparatus for positioning a chip type circuit element comprising a first claw having a first notch formed therein defining a substantially orthogonal apex portion, and a second claw having a second notch formed therein defining a substantially orthogonal apex portion, said first and second claws being movably mounted such that said apex portions of said first and second claws are in mutually opposed relationship and situated along a line passing through diagonal corners of a chip type circuit element which is positioned at a desired position.

11. A pallet for transferring chip type circuit elements including an adhesive mat constituting an upwardly facing surface for carrying said chip type circuit elements, and a plurality of lifting pins mounted for reciprocating movement between a lower position wherein an upper end thereof does not project above the surface of said mat and an upper position wherein said upper end projects above the surface of said adhesive mat.