Thermoplastic molding materials containing polymers with polyphenylene ether groups and styrene polymers
First Claim
Patent Images
1. A thermoplastic molding material containing a styrene polymer and a polyphenylene ether, wherein the polyphenylene ether is a polymer in which the phenolic hydroxyl end groups have been reacted with the anhydride groups of a copolymer of styrene and maleic anhydride, the molecular weight of which copolymer is from 500 to 7,000, measured by osmometry on a 1-5% strength by weight solution in acetone.
1 Assignment
0 Petitions
Accused Products
Abstract
Thermosplastic molding materials which contain styrene polymers and polyphenylene ethers whose phenolic hydroxyl groups have been reacted with reactive copolymers.
15 Citations
4 Claims
- 1. A thermoplastic molding material containing a styrene polymer and a polyphenylene ether, wherein the polyphenylene ether is a polymer in which the phenolic hydroxyl end groups have been reacted with the anhydride groups of a copolymer of styrene and maleic anhydride, the molecular weight of which copolymer is from 500 to 7,000, measured by osmometry on a 1-5% strength by weight solution in acetone.
Specification
-
- Resources
Litigation Campaign Assessment
Thank you for your request. You will receive a custom alert email when the Litigation Campaign Assessment is available.
×
-
Current AssigneeBASF AG (BASF SE)
-
Original AssigneeBASF AG (BASF SE)
-
InventorsBrandstetter, Franz, Naarmann, Herbert, Hambrecht, Juergen, Schuster, Hans
-
Primary Examiner(s)Ziegler, J.
-
Application NumberUS06/297,948Time in Patent Office645 DaysField of Search525/68, 525/71, 525/133, 525/132, 525/69, 525/392US Class Current525/68CPC Class CodesC08G 81/025 containing polyether sequences
