Miniaturized bus bars and methods of fabrication thereof

• US 4,401,843 A
• Filed: 03/31/1981
• Issued: 08/30/1983
• Est. Priority Date: 03/31/1981
• Status: Expired due to Fees

• Current Assignee: Rogers Towers, PA
• Original Assignee: Rogers Corporation (Rogers Communications Inc.)
• Inventors: DeVries, Donald H., Harper, William P.
• Primary Examiner(s): Envall, Jr., Roy N.
• Application Number:
  US06/249,640
• Time in Patent Office: 882 Days
• Field of Search: 174/72 B, 361/306
• US Class Current: 174/72.00B
• CPC Class Codes: H02G 5/005 Laminated bus-bars
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors

Abstract

Various structures for and methods of constructing miniaturized high capacitance bus bars are presented. The bus bars incorporate discrete high capacitive elements between a pair of bus bar conductors. Alternate arrangements are presented wherein the capacitive elements are maintained in electrical contact with the conductors while avoiding the development of short circuits between the two bus bar conductors.

Claims

1. A high capacitance bus bar assembly comprising:

at least two spatially separated bus bar conductors having inwardly facing planar surfaces;

a plurality of capacitors, said capacitors being arranged linearly and positioned between said bus bar conductors, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors facing outwardly and being in electrical contact with respective of said bus bar conductor inwardly facing surfaces; and

means for applying a mechanical force which urges said bus bar conductor inwardly facing surfaces against and into electrical contact with said capacitors conductive outer surfaces.

2. The assembly of claim 1 wherein said means for applying a mechanical force comprises:

a plurality of non-conductive fastener means, said fastener means extending through and engaging both of said bus bar conductors in regions located between at least some of said capacitors, said fastener means urging said bus bar conductors against said capacitors.

3. The assembly of claim 1 wherein said means for applying a mechanical force comprises:

non-conductive U-shaped channel means, said channel means defining an internal cavity, said cavity receiving the assembly of said bus bar conductors and said capacitors, said channel means urging said bus bar conductors against said capacitors, said channel means comprising a material which constricts upon curing.

4. The assembly of claim 2 wherein said fastener means are rivets comprised of plastic.

5. The assembly of claim 3 wherein said channel means is an irradiated polymer.

6. A high capacitance bus bar assembly comprising:

at least two spatially separated bus bar conductors having inwardly facing planar surfaces;

a plurality of capacitors, said capacitors being arranged linearly and positioned between said bus bar conductors, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors facing outwardly and being in electrical contact with respective of said bus bar conductor inwardly facing surfaces; and

a plurality of non-conductive fastener means, said fastener means extending through and engaging both of said bus bar conductors in regions located between at least some of said capacitors, said fastener means urging said bus bar conductors against said capacitors.

7. The assembly of claim 6 wherein said fastener means are rivets comprised of plastic.

8. A high capacitance bus bar assembly comprising:

at least two spatially separated bus bar conductors having inwardly facing planar surfaces;

a plurality of capacitors, said capacitors being arranged linearly and positioned between said bus bar conductors, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors facing outwardly and being in electrical contact with respective inwardlly facing surfaces of said bus bar conductors; and

non-conductive U-shaped channel means, said channel means defining an internal cavity, said cavity receiving the assembly of said bus bar conductors and said capacitors, said channel means urging said bus bar conductors against said capacitors, said channel means comprising a material which constricts upon curing.

9. The assembly of claim 8 wherein said channel means is an irradiated polymer.

10. A high capacitance bus bar assembly comprising:

at least two spatially separated bus bar conductors having inwardly facing planar surfaces;

a plurality of capacitors, said capacitors being arranged linearly and positioned between said bus bar conductors, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors being in electrical contact with respective of said bus bar conductor inwardly facing surfaces; and

non-conductive preformed sheath means, said sheath means defining an internal cavity, said cavity receiving the assembly of said bus bar conductors and said capacitors; and

a non-conductive adhesive, said adhesive adhering the assembly within said sheath means, said adhesive urging said bus bar conductors against said capacitors, said adhesive being of the type which expands volumetrically upon curing.

11. A high capcitance bus bar assembly comprising:

at least two spatially separated bus bar conductors having inwardly facing planar surfaces;

a plurality of capacitors, said capacitors being arranged linearly and positioned between said bus bar conductors, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors being in electrical contact with respective inwardly facing surfaces of said bus bar conductors; and

means for applying a mechanical force which urges said bus bar conductor inwardly facing surfaces against and into electrical contact with said capacitors conductive outer surfaces, said force applying means including;

non-conductive preformed sheath means defining an internal cavity, said cavity receiving the assembly of said bus bar conductors and said capacitors; and

a non-conductive adhesive, said adhesive adhering the assembly within said sheath means, said adhesive urging said bus bar conductors against said capacitors, said adhesive being of the type which expands volumetrically upon curing.

12. The method of fabricating a high capacitance bus bar assembly comprising the steps of:

positioning a plurality of capacitors between at least two spatially separated bus bar conductors having inwardly facing planar surfaces, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors facing outwardly and being in electrical contact with respective inwardly facing surfaces of said bus bar conductors; and

permanently holding said bus bar conductor inwardly facing surfaces against and in electrical contact with said capacitor conductive outer surfaces by means of a mechanical force.

13. The method of claim 12 wherein said mechanical force is generated by the steps of:

fastening said assembly together by extending a plurality of non-conductive fastener elements through and engaging both of said bus bar conductors in regions located between at least some of said capacitors to urge said bus bar conductors against said capacitors.

14. The assembly of claim 12 wherein said mechanical force is generated by the steps of:

locating the assembly of said bus bar conductors and said capacitors in the cavity of a U-shaped channel means, said channel means comprising a material which constricts upon curing; and

curing said channel material to generate mechanical forces urging said bus bar conductors and capacitors into contact.

15. The assembly of claim 12 wherein said mechanical force is generated by the step of:

locating the assembly of said bus bar conductors and said capacitors in non-conductive preformed sheath means, said sheath means defining an internal cavity; and

adhering the assembly within said sheath means with a non-conductive adhesive, said adhesive being of the type which expands volumetrically upon curing to urge said bus bar conductors against said capacitors.

19. The method of claim 13 wherein said step of fastening includes:

extending non-conductive rivets through and engaging both of said bus bar conductors.

16. The method of fabricating a high capacitance bus bar assembly comprising the steps of:

positioning a plurality of capacitors between at least two spatially separated bus bar conductors having inwardly facing planar surfaces, said capacitors being arranged linearly between said bus bar conductors, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors being in electrical contact with respective inwardly facing surfaces of said bus bar conductors; and

fastening said assembly together by fixing a plurality of non-conductive fastener means through and engaging both of said bus bar conductors in regions located between at least some of said capacitors, said fastener means urging said bus bar conductors against said capacitors.

20. The assembly of claim 16 wherein said step of fastening includes:

extending non-conductive rivets through and engaging both of said bus bar conductors.

17. The method of fabricating a high capacitance bus bar assembly comprising:

positioning a plurality of capacitors between at least two spatially separated bus bar conductors having inwardly facing planar surfaces, said capacitors being arranged linearly between said bus bar conductors, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors being in electrical contact with respective inwardly facing surfaces of said bus bar conductors; and

locating the assembly of said bus bar conductors and said capacitors in non-conductive channel means, said channel means defining an internal cavity, said channel means comprising a material which constricts upon curing; and

curing said channel means to urge said bus bar conductor against said capacitors.

18. The method of forming a high capacitance bus bar assembly comprising the steps of:

positioning a plurality of capacitors between at least two spatially separated bus bar conductors having inwardly facing planar surfaces, said capacitors being arranged linearly between said bus bar conductors, said capacitors each comprising a dielectric material disposed between a pair of oppositely disposed planar conductive outer surfaces, said conductive outer surfaces of said capacitors being in electrical contact with respective inwardly facing surfaces of said bus bar conductors; and

locating the assembly of said bus bar conductors and said capacitors in non-conductive preformed sheath means which define an internal cavity; and

adhering the assembly within said sheath means with a non-conductive adhesive of the type which expands volumetrically upon curing, said adhesive urging said bus bar conductors against said capacitors.