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Magnetron cathode sputtering apparatus

  • US 4,422,916 A
  • Filed: 02/11/1982
  • Issued: 12/27/1983
  • Est. Priority Date: 02/12/1981
  • Status: Expired due to Term
First Claim
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1. In apparatus for sputtering thin films of a selected coating material upon substantially planar substrates, an evacuable coating chamber, a cathode mounted horizontally in said coating chamber comprising an elongated, cylindrical tubular member having a layer of the coating material to be sputtered applied to the outer surface thereof, magnetic means located in said tubular member for providing a sputtering zone extending lengthwise thereof, means for rotating said tubular member about its longitudinal axis to bring different portions of the coating material into sputtering position opposite said magnetic means and within said sputtering zone, and means in the coating chamber for horizontally supporting the substrates and for transporting them past the magnetic means to receive the sputtered material.

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