Enclosure for electronic components

• US 4,500,944 A
• Filed: 06/06/1983
• Issued: 02/19/1985
• Est. Priority Date: 06/06/1983
• Status: Expired due to Fees

• Current Assignee: Halliburton Company
• Original Assignee: Halliburton Company
• Inventors: Looper, David W., Roberts, Don M.
• Primary Examiner(s): Pellinen, A. D.
• Assistant Examiner(s): Thompson, Gregory D.
• Application Number:
  US06/501,681
• Time in Patent Office: 624 Days
• Field of Search: 361/383, 361/384, 361/386, 361/388, 174/16 R, 165/122, 165/104.33, 165/104.34, 165/39
• US Class Current: 361/697
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Abstract

An enclosure for electronic equipment includes an outer housing having an inner housing mounted therein. The inner housing has a fan and air deflector members mounted therein for maintaining a controlled circulation of air flow within the interior region of the inner housing so that air within the interior region is moved in heat exchange relationship with a heat sink member extending into the inner housing. The heat sink member in the inner housing is connected by thermal diodes with another heat sink member attached to a side wall of the outer housing. Another fan directs an air flow over the heat sink member attached to the side wall of the outer housing. A third fan is mounted within the interior region of the outer housing, but externally of the inner housing, for providing air circulation within the interior region of the outer housing.

Claims

1. An enclosure for providing a temperature-controlled environment, comprising:

a housing, including;

a first wall;

a second wall connected to said first wall, said first and second walls defining an interior volume therebetween; and

a third wall connected to said second wall in movable relationship thereto and providing a closable entry to said interior volume;

temperature control means for transferring heat to or from said interior volume and including a heat transfer means disposed in said second wall, said heat transfer means having a surface area disposed in said interior volume;

air movement means for moving air within said interior volume, said air movement means including a fan associated with said surface area of said heat transfer means;

first baffle means for directing said air moved by said air movement means to flow in a first direction within said interior volume;

said first baffle means including;

a first angle member, having a first end and a second end disposed in said interior volume so that said first end is closer to said fan than is said second end, and so that a first channel is defined between said first angle member and said second wall, said first channel having an inlet associated with said second end and having an outlet associated with said heat transfer means; and

a second angle member having a third end and a fourth end, disposed in said interior volume so that said third end is closer to said fan than is said fourth end, and so that a second channel is defined between said second angle member and said second wall, said second channel having an inlet associated with said fourth end and having an outlet associated with said heat transfer means; and

second baffle means for directing said air which has flowed in said first direction to flow in a second direction from which said air comes into heat exchange relationship with said temperature control means, said second baffle means including;

a deflector member extending at least partially across said interior volume in overlapping association with said second and fourth ends so that said air moved by said air movement means is directed into the inlets of said first and second channels.

2. An enclosure as defined in claim 1, wherein:

said heat transfer means further includes;

a first heat sink member attached to said second wall overlying an opening therethrough;

a second heat sink member associated with said first heat sink member, said second heat sink member extending into said housing through said opening defined in said second wall; and

thermal diode means disposed between said first and second heat sink members for relatively cooling said first heat sink member and relatively heating said second heat sink member when said thermal diode means is operating in a first mode and for relatively heating said first heat sink member and relatively cooling said second heat sink member when said thermal diode means is operating in a second mode;

a first channel is defined between said first angle member and said housing, said first channel having an inlet associated with said second end and having an outlet associated with said second heat sink member;

a second angle member, having a third end and a fourth end, disposed in said second interior region so that said third end is closer to said fan than is said fourth end, and so that a second channel is defined between said second angle member and said housing, said second channel having an inlet associated with said fourth end and having an outlet associated with said second heat sink member; and

a deflector member extending through said second interior region in overlapping association with said second and fourth ends so that said air is directed into the inlets of said first and second channels.

3. An apparatus as defined in claim 2, further comprising:

second air movement means for moving air external to said first housing into heat exchange relationship with said temperature control means; and

third air movement means for moving air outside of said second housing, but within said first interior region.

4. An apparatus as defined in claim 3, wherein said first housing further includes:

a lid pivotally connected to said side wall for pivotation between an open position and a closed position; and

pneumatic lift means for retaining said lid in said open position.

5. An enclosure as defined in claim 2, wherein said deflector member includes a third angle member having a vertex substantially colinear with an axis of rotation of said fan, said third angle member also having a first curved end and a second curved end, said first and second curved ends being associated with said second and fourth ends, respectively.

6. An apparatus as defined in claim 5, further comprising:

second air movement means for moving air external to said first housing into heat exchange relationship with said first heat sink member; and

third air movement means for moving air outside of said second housing, but within said first interior region.

7. An apparatus as defined in claim 5, wherein:

a apparatus further comprises means for mounting said microcomputer within said second interior region between said first and second angle members and between said fan and said third angle member.

8. An apparatus as defined in claim 7, further comprising:

second air movement means for moving air external to said first housing into heat exchange relationship with said first heat sink member; and

third air movement means for moving air outside of said second housing, but within said first interior region.

9. An apparatus as defined in claim 8, wherein said first housing further includes:

a lid pivotally connected to said side wall for pivotation between an open position and a closed position; and

pneumatic lift means for retaining said lid in said open position.

10. An enclosure as defined in claim 1, further comprising another air movement means for moving air external to said interior volume into heat exchange relationship with said temperature control means.

11. An enclosure as defined in claim 1, wherein said deflector member includes a third angle member having a vertex substantially colinear with an axis of rotation of said fan, said third angle member also having a first curved end and a second curved end, said first and second curved ends being associated with said second and fourth ends, respectively.

12. An enclosure as defined in claim 11, further comprising an additional fan, said additional fan being associated with said heat sink member externally of said housing.

13. An enclosure as defined in claim 1, further comprising means for mounting a microcomputer within said interior volume between said first and second angle members and between said fan and said deflector member.

14. An enclosure as defined in claim 13, wherein said deflector member includes a third angle member having a vertex substantially colinear with an axis of rotation of said fan, said third angle member also having a first curved end and a second curved end, said first and second curved ends being associated with said second and fourth ends, respectively.

15. An enclosure as defined in claim 14, further comprising an additional fan, said additional fan being associated with said heat sink member externally of said housing.

16. An apparatus which contains a control panel and electronic components associated with said control panel, said apparatus comprising:

a first housing, including;

a bottom wall;

a side wall extending from said bottom wall and defining a first interior region therewith, said side wall having an opening defined therethrough; and

mounting means for connecting, in spaced relationship with said bottom wall, said control panel to said side wall;

a second housing, disposed in said first interior region between said control panel and said bottom wall, for receiving at least a portion of said electronic components, said second housing having a second interior region defined therein and an opening therethrough;

temperature control means for transferring heat to or from said second interior region through said opening in said side wall of said first housing, said temperature control means including;

a first heat sink member attached to said side wall overlying said sidewall opening;

a second heat sink member associated with said first heat sink member, said second heat sink member extending into said second housing through said second housing opening; and

thermal diode means disposed between said heat sink members for relatively cooling said first heat sink member and relatively heating said second heat sink member when said thermal diode means is operating in a first mode and for relatively heating said first heat sink member and relatively cooling said second heat sink member when said thermal diode means is operating in a second mode;

first air movement means for moving air within said second interior region including a fan associated with said second heat sink member; and

baffle means for directing said air moved by said first air movement means into heat exchange relationship with said temperature control means, said baffle means including;

a first angle member, having a first end and a second end, disposed in said second interior region so that said first end is closer to said fan than is said second end, and so that a first channel is defined between said first angle member and said second housing, said first channel having an inlet associated with said second end and having an outlet associated with said second heat sink member;

a second angle member, having a third end and a fourth end, disposed in said second interior region so that said third end is closer to said fan than is said fourth end, and so that a second channel is defined between said second angle member and said second housing, said second channel having an inlet associated with said fourth end and having an outlet associated with said second heat sink member; and

a deflector member extending at least partially across said second interior region in overflapping association with said second and fourth ends so that said air is directed into the inlets of said first and second channels.