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Cylindrical post magnetron sputtering system

  • US 4,525,264 A
  • Filed: 12/07/1981
  • Issued: 06/25/1985
  • Est. Priority Date: 12/07/1981
  • Status: Expired due to Fees
First Claim
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1. A system for sputtering within a vacuum chamber containing a partial pressure of an ionizable gas including:

  • means providing a generally cylindrical closed surface cathode having a defined length dimension and the outer portion of said closed surface containing material to be sputtered therefrom;

    means defining an anode adjacent said cathode;

    means for generating a biasing voltage potential and providing connection of said potential between said cathode means and said anode means;

    means mounted within said closed surface cathode means for generating a magnetic field oriented to define a closed loop electron confinement tunnel over the length of said cathode;

    said magnetic field generating means including at least two flexible magnets each having oppositely disposed surfaces of opposite polarity adjacently wrapped around a support mandrel so that for each magnet one of said oppositely disposed surfaces faces the mandrel while the other surface is exposed and adjacent exposed surfaces are of opposite polarity, and the joint between the adjacent surfaces defines said closed loop electron confinement tunnel.

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