Forming multilayer ceramic substrates from large area green sheets

• US 4,539,058 A
• Filed: 12/12/1983
• Issued: 09/03/1985
• Est. Priority Date: 12/12/1983
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Melvin, George E., Burgess, Allan C., Magee, Robert A.
• Primary Examiner(s): Weston, Caleb
• Application Number:
  US06/560,099
• Time in Patent Office: 631 Days
• Field of Search: 156/64, 156/89, 156/245, 156/250, 156/256, 156/261, 156/264, 156/510, 156/512, 156/518, 156/528, 156/530, 156/378, 156/379, 156/350, 156/351, 29/825, 29/826, 29/830, 29/833, 29/834, 29/835, 29/836
• US Class Current: 156/250
• CPC Class Codes: H01L 21/4807 Ceramic parts
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2203/0169 Using a temporary frame during processing
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: H05K 3/005 Punching of holes
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
• CPC Class Codes: H05K 3/4638 Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 156/107 Punching and bonding pressure application by punch
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/12 Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
• CPC Class Codes: Y10T 156/13 Severing followed by associating with part from same source
• CPC Class Codes: Y10T 156/1378 Cutter actuated by or secured to bonding element

Abstract

A method and apparatus for forming multilayer ceramic substrates from large area ceramic green sheets, each having an array of layer sites thereon, by serially aligning each individual layer site with respect to a die cavity and punching the aligned layer site into the die cavity to thereby stack the requisite number of aligned layer sites. Individual layer site alignment ensures that each layer site is aligned with respect to the die cavity so that the dimensional tolerances between layer sites on the large area green sheet are eliminated. Thus, as large a green sheet as is cost effective may be employed, notwithstanding the fact that dimensional distortions on the large area green sheet would preclude alignment of corresponding layer site vias on superimposed large area green sheets.

Claims

1. A method of forming a multilayer ceramic substrate comprising the steps of:

fabricating an array of layer sites on a large area ceramic green sheet, each layer site comprising a plurality of conductive vias interconnected with a surface conductive pattern, the area of said ceramic green sheet being sufficiently large to preclude alignment of corresponding vias on superimposed large area ceramic green sheets;

aligning a reference mark on one of said layer sites with respect to a die cavity by determining the dimensional offset of said reference mark from its nominal position and indexing said layer site with respect to said die cavity with said dimensional offset being applied such that said reference mark lies a predetermined distance from the edge of said die cavity;

punching the aligned individual layer site into said die cavity;

repeating said aligning and punching steps to stack a plurality of aligned and punched layer sites; and

laminating the stacked plurality of aligned and punched layer sites to form a multilayer ceramic substrate;

whereby the vias in the stacked layer sites are aligned notwithstanding the dimensional distortion of layer sites with respect to one another on said large area ceramic green sheet.

2. The method of claim 1 wherein said large area ceramic green sheet includes an array of layer sites for one multilayer ceramic substrate, and wherein the plurality of aligned and punched layer sites are stacked in one die cavity.

3. The method of claim 1 wherein said determining step comprises the step of:

indexing said layer site to its nominal position with respect to a detector;

detecting the actual position of said reference mark; and

calculating the dimensional difference between the actual position and the nominal position.

4. The method of claim 1 wherein said reference mark is a fiducial mark on said layer site.

5. The method of claim 1 wherein said reference mark is a predetermined via on said layer site.

6. The method of claim 1 wherein said large area ceramic green sheet includes an array of identical layer sites, wherein each aligned and punched layer site is placed in a respective one of a plurality of die cavities, and wherein said aligning and punching steps are repeated on a plurality of large area ceramic green sheets each of which includes an array of identical layer sites, to thereby stack a plurality of aligned layer sites in each of said plurality of die cavities.

7. Apparatus for forming a multilayer ceramic substrate from a large area ceramic green sheet having an array of layer sites thereon, each layer site comprising a plurality of conductive vias interconnected with a surface conductive pattern, the area of said ceramic green sheet being sufficiently large to preclude alignment of corresponding vias on superimposed large area ceramic green sheets, said multilayer ceramic forming apparatus comprising;

a die cavity for stacking layer sites therein;

means for aligning a reference mark on a layer site with respect to said die cavity;

means for punching an aligned layer site from a large area ceramic green sheet into said die cavity;

whereby the vias in each stacked layer site in said die cavity are aligned notwithstanding the dimensional distortion of layer sites with respect to one another on said large area ceramic green sheet; and

means for preventing green sheet debris from falling into said die cavity.

8. The apparatus of claim 7 further comprising a plurality of die cavities;

and,

means for aligning a predetermined one of said plurality of die cavities with respect to said punching means to thereby punch an aligned layer site into said predetermined one of said plurality of die cavities.

9. The apparatus of claim 7 wherein said preventing means is a shutter having an opening therein, said opening being positioned over said die cavity when said aligned layer site is punched into said die cavity, said shutter being positioned over said die cavity when said punching means is retracted from said die cavity.

10. The apparatus of claim 7 wherein said aligning means comprises:

means for determing the dimensional offset of said referecne mark from its nominal position; and

,

means for indexing said layer site with respect to said die cavity, with said dimensional offset being applied.