Manipulation and handling of integrated circuit dice

  • US 4,626,167 A
  • Filed: 03/22/1984
  • Issued: 12/02/1986
  • Est. Priority Date: 03/22/1984
  • Status: Expired due to Term
First Claim
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1. A method of manipulating integrated circuit dice having a contact side and a substrate side comprising the steps of:

  • a. depositing at least one integrated circuit die contact side down in at least one of a first linear array of receptacles positioned initially at predetermined intervals along a first axis in a first substantially horizontal plane;

    b. rotating said array of receptacles 180 degrees about a first rotation axis parallel to said first plane, whereby said at least one integrated circuit die is contact side up;

    c. dropping said at least one die into a second, corresponding array of receptacles spaced at said predetermined intervals along a second axis parallel to said first axis and aligned vertically with said initially positioned first linear array of receptacles, whereby said dice rest in said second corresponding array contact side up; and

    d. precising said die prior to dropping said die into said second array of receptacles and after said step of rotating by slidably aligning said die from an initial position to an aligned position.

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