Method of manufacturing an ultrasonic transducer

• US 4,747,192 A
• Filed: 08/14/1986
• Issued: 05/31/1988
• Est. Priority Date: 12/28/1983
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Rokurota, Haruyasu
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US06/896,346
• Time in Patent Office: 656 Days
• Field of Search: 29/25.35, 29/840, 310/326, 310/327, 310/334-337, 310/800, 310/366
• US Class Current: 29/25.35
• CPC Class Codes: B06B 1/0629 Square array
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

Electrode layers are formed on planes of a plate-shaped piezoelectric element to provide an ultrasonic transducer material. The ultrasonic transducer material is bonded to an electrically insulating substrate by electrically conductive adhesive. A plurality of conductors is provided on the substrate in the array direction and a direction perpendicular to the array direction. A printed circuit is formed on the backside of the substrate to connect the conductors. Notches are cut out in the ultrasonic transducer material to divide it into a plurality of transducer elements arranged in the array direction and a direction perpendicular to the array direction. A ground electrode connects the second electrodes of the ultrasonic transducer elements. The transducer elements are impressed with voltage through the printed circuit and ground electrode to issue ultrasonic waves.

Claims

1. A method of manufacturing an ultrasonic transducer, which comprises the steps of:

forming an arrangement of a plurality of conductors penetrating an insulation member having first and second planes, thereby effecting electrical conduction between said first and second planes;

forming a printed circuit on the second plane of the insulation member to be connected to the conductors;

forming first and second electrodes on surfaces of a plate-shaped piezoelectric element, respectively, to provide a plate-shaped ultrasonic transducer member;

directly fixing the unltrasonic transducer member to the first plane of the insulation member with an electrically conductive adhesive, so as to effect connection between the second electrode and said conductors;

then

cutting out notches in the plate-shaped ultrasonic transducer member corresponding to the arrangement of the conductors to divide it into a plurality of individual ultrasonic transducer isolated elements each individual element having a respective conductor;

forming a ground electrode connected to the first electrodes adhering an ultrasonic wave absorber to the second plane of the insulation member, thereby dampening the vibrations of the transducer elements.

2. The method according to claim 1, which comprises the steps of cutting the notches extending in the array direction and a direction perpendicular to the array direction and providing a plurality of transducer elements extending in the array direction.

3. The method according to claim 1, which comprises the steps of rendering the insulation member convex with the second plane thereof on the concave side, and adhering the insulation member to the surface of the ultrasonic wave absorber, thereby causing the ultrasonic wave transmission-reception planes of all the transducer elements of the ultrasonic transducer to be rendered convex in the array direction.

4. The method according to claim 1, wherein said insulation member has a width dimension larger than that of the ultrasonic wave absorber and the printed circuit is disposed on said second plane of the insulation member so as to expose a portion of the printed circuit.