Power semiconductor module
First Claim
1. Power semiconductor module, comprising a multi-layered substrate formed of a first ceramic bottom plate, at least one second ceramic plate disposed above and parallel to said first ceramic bottom plate, a metal foil in the form of a textured metallization having a thickness of substantially between 0.1 and 0.5 mm located between and directly bonded to said ceramic plates, said second ceramic plate having cutouts formed therein defining a soldering form, and assembly elements fixed in place by said soldering form and soldered in said cutouts.
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Accused Products
Abstract
A power semiconductor module includes a multi-layered substrate formed of a first ceramic bottom plate, at least one second ceramic plate disposed above and parallel to the first ceramic bottom plate, a metal foil in the form of a textured metallization located between and directly bonded to the ceramic plates, the second ceramic plate having cutouts formed therein, and assembly elements soldered in the cutouts.
49 Citations
10 Claims
- 1. Power semiconductor module, comprising a multi-layered substrate formed of a first ceramic bottom plate, at least one second ceramic plate disposed above and parallel to said first ceramic bottom plate, a metal foil in the form of a textured metallization having a thickness of substantially between 0.1 and 0.5 mm located between and directly bonded to said ceramic plates, said second ceramic plate having cutouts formed therein defining a soldering form, and assembly elements fixed in place by said soldering form and soldered in said cutouts.
- 5. Power semiconductor module, comprising a multi-layered substrate formed of a first ceramic bottom plate, at least one second ceramic plate disposed above and parallel to said first ceramic bottom plate, a metal foil in the form of a textured metallization having a thickness of substantially between 0.1 and 0.5 mm located between and directly bonded to said ceramic plates, said second ceramic plate having cutouts formed therein defining a soldering form, and assembly elements fixed in place by said soldering form and soldered in said cutouts, said textured metallization and said second ceramic plate forming striplines having a defined wave resistance.
- 7. Power semiconductor module, comprising a multi-layered substrate formed of a first ceramic bottom plate having a lower surface, at least one second ceramic plate disposed above and parallel to said first ceramic bottom plate, a metal foil in the form of a textured metallization having a thickness of substantially between 0.1 and 0.5 mm located between and directly bonded to said ceramic plates, another metallization disposed on said lower surface of said first ceramic plate, said second ceramic plate having cutouts formed therein defining a soldering form, and assembly elements fixed in place by said soldering form and soldered in said cutouts, said metallizations and said second ceramic plate forming striplines having a defined wave resistance.
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10. Power semiconductor module, comprising a multi-layered substrate formed of a first ceramic bottom plate, at least one second ceramic plate disposed above and parallel to said first ceramic bottom plate, a metal foil in the form of a textured metallization having a thickness of substantially between 0.1 and 0.5 mm located between and directly bonded to said ceramic plates, said second ceramic plate having cutouts formed therein defining a soldering form, assembly elements fixed in place by said soldering form and soldered in said cutouts, and a further metallization disposed on said second ceramic plate, said second ceramic plate and said metallizations having recesses and bores formed therein permitting a soft casting compound introduced therein to creep into given locations in the module.
Specification