Manufacture of microsieves and the resulting microsieves

  • US 4,772,540 A
  • Filed: 08/30/1985
  • Issued: 09/20/1988
  • Est. Priority Date: 08/30/1985
  • Status: Expired due to Term
First Claim
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1. In the method of making a microsieve in which(a) a layer of photoresist is applied to an electrically conductive substrate,(b) preselected areas of the photoresist are fixed to provide a patterned surface in the form of a grid-like array of discrete areas of fixed photoresist,(c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate,(d) the substrate is electroplated, and(e) the substrate and fixed photoresist are removed to provide a finished microsieve;

  • the improvement comprising imparting to the finished microsieve greater rigidity and resistance to mechanical distortion by;

    preparing the electrically conductive substrate required for step (a) by the sub-steps of;

    (i) providing a rigid, electrically conductive frame member having a relatively large aperture defined within a major surface thereof, the area constituting the large aperture being at least equal to the area of the grid-like array of micro-apertures possessed by the finished microsieve;

    (ii) filling the large aperture with a hardenable electrically conductive material; and

    (iii) permitting the electrically conductive material to harden to provide a smooth-surfaced electrically conductive substrate corresponding to the configuration of the large aperture and surrounded by the electrically conductive frame member.

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