Phased array transducer construction

• US 4,773,140 A
• Filed: 10/31/1983
• Issued: 09/27/1988
• Est. Priority Date: 10/31/1983
• Status: Expired due to Fees

• Current Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Original Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Inventors: McAusland, Robert R.
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US06/547,150
• Time in Patent Office: 1,793 Days
• Field of Search: 29/25.35, 310/334, 310/345, 310/348
• US Class Current: 29/25.35
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A method of manufacturing a phased array ultrasound transducer, and the transducer manufactured by the inventive method are described. In the method, a piezoelectric crystal is soldered to the edges of a pair of double sided printed circuit boards, each of which has traces on either side. Then, a backing material is poured to secure the crystal and boards, and a saw is used to define the elements of the transducer.

Claims

1. The method of manufacturing a phased array ultrasound transducer of the type comprising a bar of piezoelectric material which has been separated into a series of parallel elements comprising the steps of:

(a) metalizing both sides of a bar of piezoelectric material;

(b) providing a pair of double sided printed circuit boards, each having a series of traces formed thereon, said traces each having a pitch which is substantially one-fourth the pitch of elements desired on said phased array ultrasound transducer, said traces overlapping the top edge of each of said boards;

(c) soldering said bar of piezoelectric material onto said top edges of said boards;

(d) pouring a nonconductive backing material into the space between said boards, said backing material being selected to bond to said boards and to said bar of piezoelectric material, whereby mechanical integrity of the structure is provided;

(e) defining said elements of said array by cutting through said bar of piezoelectric material and through the portion of said traces which extends over said top edges of said board, whereby a series of electrically isolated elements, each contacted by only one of said traces is formed; and

(f) forming an electrical contact to the tops of said elements.