Process and apparatus for treating wafers with process fluids

  • US 4,778,532 A
  • Filed: 08/13/1985
  • Issued: 10/18/1988
  • Est. Priority Date: 06/24/1985
  • Status: Expired due to Term
First Claim
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1. An enclosed, full flow method for the cleaning of semiconductor wafers comprising positioning said wafers in a vessel, closing said vessel to the environment, and flowing process fluids sequentially and continuously past said wafers in said vessel, including the steps of(a) contacting said wafers with at least one cleaning fluid to remove contaminants from said wafers;

  • (b) removing said cleaning fluid from said wafers with a rinsing fluid; and

    (c) removing said rinsing fluid from said wafers with a drying fluid;

    whereby the processing does not requirement movement or operator handling of said wafers between said steps; and

    maintaining the vessel containing said wafers hydraulically full during each process step.

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