Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor

• US 4,787,143 A
• Filed: 05/19/1986
• Issued: 11/29/1988
• Est. Priority Date: 12/04/1985
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Tsuji, Masami, Shutou, Hirokazu, Yagi, Hiroshi, Ohta, Masanori
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US06/865,067
• Time in Patent Office: 925 Days
• Field of Search: 29/407, 29/740, 29/759, 29/834, 29/833, 29/702, 29/710, 29/712, 29/720, 29/705, 235/375
• US Class Current: 29/833
• CPC Class Codes: G01R 31/2656 using non-ionising electromagnetic radiation, e.g. optical radiation
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53022 with means to test work or product
• CPC Class Codes: Y10T 29/53043 including means to divert defective work part
• CPC Class Codes: Y10T 29/53052 including position sensor
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

A method and apparatus for detecting and enabling correction of a failure in the mounting of electronic parts on substrates, capable of automatically and efficiently accomplishing the detection of a failure in the mounting of electronic parts on substrates, and classification between failed substrates and acceptable substrates to improve the overall operation efficiency of an electronic parts mounting line. The method is adapted to apply a code mark to each substrate on which electronic parts are to be mounted, detect a failure the mounting after, read and store the code marks and failure data of failed substrates, and classify the failed substrates from acceptable substrates and transfer the failed substrates on the basis of the code marks and failure data stored.

Claims

1. A method of detecting a failure in the mounting of electronic parts on substrates, comprising the steps of:

applying a different code mark, to a surface of each substrate on which electronic parts are to be mounted;

detecting a failure in the mounting of said electronic parts on each of said substrates after the mounting by checking for at least one of proper electrical functioning of said parts and proper physical positioning of said parts relative to each of said substrates;

reading the code mark of each substrate for which a failure is detected thereby identifying failed substrates;

classifying said failed substrates from acceptable substrates and transferring said failed substrates to a station for correction of the failures.

2. A method as defined in claim 1, wherein said code mark is formed by applying a bar code.

3. A method as defined in claim 1, including returning said failed substrates to a conveyor for said acceptable substrates after a failure correcting operation.

4. A method of detecting a failure in the mounting of electronic parts on substrates, comprising the steps of:

applying a different code mark, to a surface of each substrate on which electronic parts are to be mounted;

detecting a failure in the mounting of said electronic parts on each of said substrates after the mounting by checking for at least one of proper electrical functioning of said parts and proper physical positioning of said parts relative to each of said substrates;

reading the code mark of each substrate for which a failure is detected thereby identifying failed substrates, and storing code mark data of the corresponding failed substrates together with detected mounting failure data;

classifying said failed substrates from acceptable substrates and transferring said failed substrates to a correcting station on the basis of said stored code mark data and mounting failure data; and

indicating details of mounting failure of each of said failed substrates to facilitate correction of each failed substrate at said correcting station.

5. A method as defined in claim 4, wherein said code mark is formed by applying a bar code.

6. A method as defined in claim 4, including returning said failed substrates to a conveyor for said acceptable substrates after a failure correcting operation.

7. An apparatus for detecting a failure in the mounting of electronic parts on substrates, comprising:

a characteristic checker for detecting substrates on which electronic parts having characteristics other than predetermined ones are mounted, to identify failed substrates;

a misregistration checker for detecting a default in the parts mounting, the positional deflection of the mounted electronic parts with respect to each of said substrates, and an error in the mounting direction;

a separating conveyor for carrying out a classification between the failed substrates and acceptable substrates;

a failure indicator for indicating details of a failure of each of said failed substrates to facilitate correction of each failed substrate;

a code reader incorporated in each of said characteristic checker, misregistration checker, separating conveyor and failure indicator to read a code mark attached to each of said substrates;

control boxes connected to said characteristic checker, misregistration checker and separating conveyor, respectively;

a mounting failure data edit controller connected through said control boxes to said characteristic checker, misregistration checker and separating conveyor, respectively, and further connected to said failure indicator;

said mounting failure data edit controller including means for editing and storing mounting failure data of the failed substrates as supplied from said respective checkers through the corresponding control boxes together with code mark data of the corresponding failed substrates as read by the corresponding code reader of each of said characteristic checker and misregistration checker;

said mounting failure data edit controller also including means for carrying out collating between said code mark data stored therein and code mark data read by said code reader of said separating conveyor to identify said failed substrates, so that said separating conveyor is enabled to carry out its classification operation;

said failure indicator selectively calling said mounting failure data stored in said mounting failure data edit controller therefrom depending upon the code mark of each of said failed substrates as read by said code reader of said failure indicator to indicate details of the called mounting failure data.

8. A method of detecting a failure in the mounting condition of electronic parts on substrates, comprising the steps of:

attaching a different code mark to each of the substrates;

arranging in rows a plurality of substrates each having electronic parts mounted thereon;

observing images of said electronic parts as mounted on the substrates;

successively checking said images of said electronic parts and producing check data indicative of the mounting condition of the parts on said substrate;

processing and storing said check data together with the code marks attached to said substrates;

identifying failed substrates on the basis of the stored check data and code marks; and

carrying out correction of failed substrates on the basis of said stored data.

9. An apparatus for detecting a failure in the mounting condition of electronic parts on substrates, comprising:

an X-Y table for arranging in rows a plurality of substrates each having electronic parts mounted thereon and a different identifying code mark;

a plurality of checking cameras arranged above said X-Y table at positions corresponding to the positions at which said substrates are arranged;

a vision checker for successively checking images supplied from said checking cameras to generate check data indicative of the mounting condition of the part on the substrates; and

data edit controller means for processing and storing check data together with the code marks attached to each of said substrates to enable correction of failed substrates on the basis of said data stored therein, including means for identifying the failed substrates on the basis of the stored check data and code marks.

10. A method of detecting a failure in the mounting condition of electronic parts on substrates, comprising the steps of:

irradiating light to a substrate having electronic parts mounted thereon in a downward direction to form a shade region on the substrate about said electronic parts;

partially demarcating an image of said electronic parts with said shade at a plurality of points along the peripheries of said electronic parts; and

observing the contrast of the partially demarcated image with said shade to detect a failure in the mounting condition of said electronic parts on said substrate.