Phosphite modified epoxy resin

• US 4,788,235 A
• Filed: 11/23/1987
• Issued: 11/29/1988
• Est. Priority Date: 11/23/1987
• Status: Expired due to Fees

• Current Assignee: 3M Company
• Original Assignee: 3M Company
• Inventors: Johnson, Michael A.
• Primary Examiner(s): Nielsen, Earl
• Application Number:
  US07/123,794
• Time in Patent Office: 372 Days
• Field of Search: 523/451, 528/89, 528/92, 528/108, 528/374, 528/400, 525/122
• US Class Current: 523/451
• CPC Class Codes: C08K 5/0091 Complexes with metal-heteroatom-bonds
• CPC Class Codes: C08K 5/526 with hydroxyaryl compounds
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Abstract

Composition comprising an epoxy resin, an adduct of a tetra-substituted titanate and a di-substituted hydrogen phosphite, a neutral ester of a phosphorous acid, and a curing agent for the epoxy resin.

The composition is particularly useful as an adhesive for bonding structures made of sheet molding compound to like structures, to steel, and to other substrates commonly used in the automotive area.

Claims

1. Composition comprising an epoxy resin, a phosphite ester, an adduct of a tetra-substituted titanate and a di-substituted hydrogen phosphite, and a curing agent for said epoxy resin, provided that said phosphite ester is present in an amount sufficient, if it were present by itself, to bring about reduction of viscosity of the epoxy resin, further provided that said adduct is present in an amount sufficient, if it were present by itself, to bring about reduction of viscosity of the epoxy resin.

2. The composition of claim 1 wherein said phosphite ester has the structure ##STR5## wherein X is a divalent chalkogen atom having an atomic weight of less than 35, R¹ and R² are like or unlike organic radicals, R³ is hydrogen or an organic radical.

3. The composition of claim 1 wherein said phosphite ester is selected from the group consisting of di-substituted hydrogen phosphites and trisubstituted phosphites.

4. The composition of claim 3 wherein said phosphite ester is triphenyl phosphite.

5. The composition of claim 3 wherein said phosphite ester is di(tridecyl) phosphite.

6. The composition of claim 1 wherein about 0.01 to about 300 parts phosphite ester is used per 100 parts epoxy resin.

7. The composition of claim 1 wherein said adduct is an adduct of di-substituted hydrogen phosphite having the formula (R'"'"'O)₂ P(O)H and tetra-substituted titanate having the formula (R"O)₄ Ti, where R'"'"' and R" represent monovalent alkyl, aryl, alkenyl, aralkyl or alkaryl groups, or alkoxy, aroxy, chloro or bromosubstituted derivatives thereof.

8. The composition of claim 1 wherein said adduct is prepared by reacting one mole of titanate with two moles of phosphite.

9. The composition of claim 1 wherein about 0.01 to about 50 parts adduct is used per 100 parts epoxy resin.

10. The composition of claim 1 wherein about 0.01 to about 300 parts phosphite ester and about 0.01 to about 50 parts adduct is used per 100 parts epoxy resin.

11. The composition of claim 1 wherein said curing agent is selected from the group consisting of amines, polyamines, and mercaptans.

12. The composition of claim 1 wherein said curing agent is an amine-terminated butadiene acrylonitrile copolymer.

13. An article made of sheet molding compound bearing an adhesive thereon obtained by curing the composition of claim 1.