Method for cold bonding

• US 4,804,132 A
• Filed: 08/28/1987
• Issued: 02/14/1989
• Est. Priority Date: 08/28/1987
• Status: Expired due to Term

• Current Assignee: Bio Lab Naturals, Inc. (Limitless X Holdings, Inc.)
• Original Assignee: Louis Difrancesco
• Inventors: DiFrancesco, Louis
• Primary Examiner(s): Rowan, Kurt
• Application Number:
  US07/090,608
• Time in Patent Office: 536 Days
• Field of Search: 228/115, 228/116, 228/208, 228/248, 228/263.17, 29/521
• US Class Current: 228/115
• CPC Class Codes: B23K 20/24 Preliminary treatment
• CPC Class Codes: H01L 24/80 Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

The present invention is a method for bonding two surfaces without applying heat. The surfaces are prepared so that they both have an outermost layer of aluminum. One of the surfaces has metallized particles that protrude at the desired bonding points. When the two surfaces are brought into contact, the particles pierce the aluminum surface, displacing any aluminum oxide that may be present. This provides two virgin aluminum surfaces on contact with each other, which allows the formation of a metal matrix, thus bonding the two surfaces. The strength of the bond can be controlled by varying the piercing depth and size of the particles. The material for the particles may be chosen so that the bond is both electrically and thermally conductive, either electrically or thermally conductive, or both electrically and thermally insulative.

Claims

1. A method for bonding two surfaces together without applying heat, the bond being formed via a metal matrix that is created when the two surfaces, having been prepared so that both surfaces have an outermost layer of aluminum, are brought into contact with each other in a manner so as to displace any aluminum oxide present, thus providing the contact of two virgin (non-oxidized) aluminum surfaces, wherein one of the surfaces to be bonded is prepared so that, at desired bonding points, aluminum coated particles protrude from the surface, providing discrete contact points with the other surface.

2. The method of claim 1 wherein:

said particles pierce the surface of the aluminum and cause any oxide layer present to be displaced so that virgin aluminum surfaces are exposed.

3. The method of claim 2 wherein:

said particles are industrial grade diamonds.

4. The method of claim 2 wherein:

said particles are chosen from the class of alumina, quartz, and borosilicate.

5. The method of claim 2 wherein:

the strength of the bond formed is variable and is controlled by the depth of piercing and size of said particle, and hence the surface area of virgin aluminum exposed.

6. The method of claim 2 wherein:

the surfaces are prepared by applying various metal layers through photolithographic or metal addition processes, the outermost layer necessarily being aluminum.

7. The method of claim 6 wherein:

a breakaway layer is provided on one of the surfaces, the breakaway layer being formed from a material chosen so as to have the lowest melting point of any of the metal layers.

8. The method of claim 2 wherein:

the material for the particles may be chosen so as to be both electrically and thermally conductive, either electrically or thermally conductive, or both electrically and thermally insulative.

9. A method for die/package interconnect bonding, the bond being a metal matrix formed between an outer layer of virgin aluminum on the die and an outer layer of virgin aluminum on a bond pad of the package, wherein the package is formed to include a plurality of metalized particles protruding from its surface at the desired bonding spots so that when the die and package are brought together, said particles first contact the bond pad and displace any aluminum oxide that may be present, thus providing the mating of two virgin aluminum surfaces.

10. The method of claim 9 wherein:

the material to be used for said particles is chosen so as to control the electrical and/or thermal conductivity of the interconnect bond.

11. The method of claim 9 wherein:

the strength of the interconnect bond is controlled by the depth of piercing and size of the particles and choice of exterior metal layer.

12. The method of claim 9 wherein:

a breakaway layer is provided on the die, the breakaway layer being a material with a melting point lower than that of the other materials present on the die, so that when heat is applied, the bond is broken at the breakaway layer.

13. The method of claim 9 wherein:

the material for the particles is either industrial diamond or from the class of alumina, quartz, and borosilicate.

14. A method for bonding together a first generally locally planar surface and a second generally locally planar surface, in steps comprising:

A. coating the first surface with a first layer of aluminum;

B. coating the second surface with a second layer of aluminum including a plurality of discrete particles embedded therein at selected bonding zones, said discrete particles being completely coated, on the exterior facing surfaces thereof, by said second layer of aluminum; and

C. forcing the first surface against the second surface in a perpendicular manner such that said particles embedded in said second layer of aluminum pierce both said second layer and said first layer of aluminum, the force of such piercing exposing juxtaposed areas of virgin aluminum in both of said first and said second layers, such that adjacent exposed areas of virgin aluminum are caused to bond to each other by material affinity.

15. The method of claim 14 wherein said particles are selected to be multifaceted such that said piercing displaces maximal aluminum.

16. The method of claim 14 wherein a light amount of force is utilized in step C, such that the degree of said piercing is slight and disengagement of the bond may be accomplished with slight detriment to said first and said second aluminum layers.

17. The method of claim 16 and further including the following steps:

D. inspecting/testing the juxtapositional alignment of the first and second surfaces to assure that desired alignment has been achieved; and

E. repeating step C with a greater amount of force such that a greater degree of piercing is achieved and a more permanent bond is formed.

18. The method of claim 14 wherein:

said particles are selected to be irregular solids having effective diameters less than the sum of the thicknesses of said first layer of aluminum and said second layer of aluminum, thus assuring said particles do not pierce the first and second surfaces and cause detriment thereto.