Printed circuit devices using thermoplastic resin cover plate

• US 4,814,943 A
• Filed: 06/02/1987
• Issued: 03/21/1989
• Est. Priority Date: 06/04/1986
• Status: Expired due to Term

• Current Assignee: OKI Electric Industry Company Limited
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Okuaki, Hiroshi
• Primary Examiner(s): NOT, DEFINED
• Application Number:
  US07/057,385
• Time in Patent Office: 658 Days
• Field of Search: 361/400, 361/399, 174/52 PE, 174/52 FP, 174/52 S, 206/328, 206/329, 206/332
• US Class Current: 361/783
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13599 Material
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 : Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/1617 : Cavity coating
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A printed circuit device including semiconductor IC chips on the surface of a printed circuit board made of insulating material. The printed circuit board includes on the surface thereof semiconductor mounting regions and conductive layers. The semiconductor IC chips are respectively fixedly mounted on the semiconductor element mounting regions disposed on the printed circuit board. Thin metal wires interconnect electrodes of the IC chips with the conductive layers. A sealing cover plate having a plurality of recesses formed therein is fixedly mounted onto the surface of the printed circuit board with adhesive for hermetically sealing each of the IC chips and electric wires with a respective one of the recesses in the cover plate. The cover plate can comprise a composite of a thermoplastic resin material layer and a metal layer, such as aluminum or an aluminum alloy.

Claims

1. A printed circuit device comprising:

(a) a printed circuit board having on the surface thereof a plurality of semiconductor element mounting regions and a plurality of conductive wiring layers, said printed circuit board being of an electrically insulating material;

(b) a plurality of semiconductor integrated circuit chips each adhesively mounted on a respective one of said mounting regions with a conductive adhesive paste material;

(c) metal wires electrically connecting electrodes of said chips with said conductive wiring layers;

(d) a protective layer formed over said wiring layers for protecting said wiring layers from damage, said protective layer being of a plastic resin material;

(e) a layer of a thermoplastic resin material formed on the surface of said protective layer; and

(f) a sealing cover plate of a thermoplastic resin material adhesively mounted on the surface of said board through a heat bonding process, said plate having a plurality of recessed portions, each of which hermetically accommodates one of said chips, said recessed portions of said sealing cover plate being separated from said chips by an empty space.

2. A printed circuit device according to claim 1, wherein said printed circuit board has positioning holes located near a periphery of said board and wherein said sealing cover plate has a plurality of projections respectively inserted into said holes for providing easy alignment of said sealing cover plate with said board.

3. A printed circuit device according to claim 1, wherein said thermoplastic resin material comprises a material selected from the group consisting of polyethylene, polypropylene and polymethylpentene.

4. A printed circuit device according to claim 3, further comprising a plurality of frame means of a resin impregnated material each mounted on said protective layer and surrounding one of said semiconductor integrated circuit chips and said metal wires;

and a sealing material layer filled in said frame means to protect each of said chips from moisture.

5. A printed circuit device according to claim 3, further comprising a metal layer next to said cover of a thermoplastic resin material to mechanically strengthen said cover.

6. A printed circuit device comprising:

(a) a printed circuit board having on the surface thereof a plurality of semiconductor element mounting regions and a plurality of conductive wiring layers, said printed circuit board being of an electrically insulating material;

(b) a plurality of semiconductor integrated circuit chips each adhesively mounted on a respective one of said mounting regions with a conductive adhesive paste material;

(c) metal wires electrically connecting electrodes of said chips with said conductive wiring layers;

(d) a protective layer formed over said wiring layers for protecting said wiring layers from damage, said protective layer being of a plastic resin material;

(e) a layer of a thermoplastic resin material formed on the surface of said protective layer; and

(f) a sealing cover plate of a thermoplastic resin material adhesively mounted on the surface of said board through a heat bonding process, said plate having a plurality of recessed portions, each of which hermetically accommodates one of said chips, said sealing cover plate including a flat portion thereof surrounding each of said recessed portions, said flat portion being adhered to said layer of thermoplastic resin on the surface of said protective layer.