Encapsulating electronic components

• US 4,826,896 A
• Filed: 03/19/1987
• Issued: 05/02/1989
• Est. Priority Date: 03/19/1987
• Status: Expired due to Term

• Current Assignee: Loctite Corporation (Henkel AG & Co KGaA)
• Original Assignee: Dexter Corp. (Thermo Fisher Scientific Incorporated)
• Inventors: Procter, Philip J.
• Primary Examiner(s): Wyse, Tom
• Application Number:
  US07/027,795
• Time in Patent Office: 775 Days
• Field of Search: 264/272.11, 264/272.13, 523/440, 523/442-445, 523/457-459
• US Class Current: 523/443
• CPC Class Codes: C08K 3/14 Carbides
• CPC Class Codes: H01B 3/40 epoxy resins
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25×10^-4 cal/cm-sec-°C.) and improved stress characteristics (e.g. a thermal shock cycle number of at least 30).

Claims

1. A non-conductive composition for encapsulating an electronic component comprising an encapsulating resin blended with at least 50 percent by weight of a filler including sufficient silicon carbide particles to cause the thermal conductivity of said encapsulating composition to be at least 25×

10^-4 cal/cm-sec-°

C. and the thermal shock cycle number to be at least 30.

2. The composition of claim 1 wherein said silicon carbide is treated with a coupling agent to improve adhesion to said encapsulating resin and reduce the electrical conductivity of said composition.

3. The composition of claim 2 wherein said coupling agent comprises an organosilane, organosilazane, or organotitanate.

4. The composition of claim 2 wherein said thermal conductivity of said composition is at least 60×

10^-4 cal/cm-sec-°

C.

5. The composition of claim 2 wherein said thermal shock cycle number of said composition is at least 40.

6. The composition of claim 1 wherein said filler further comprises silica, alumina, boron nitride, magnesium aluminosilicate, and magnesium oxide, or a combination thereof.

7. The composition of claim 6 wherein the weight percent of said silica in said composition is between 10 and 40.

8. The composition of claim 6 wherein the weight percent of said alumina in said composition is between 10 and 40.

9. The composition of claim 6 wherein the weight percent of said boron nitride in said composition is between 1 and 10.

10. The composition of claim 6 wherein the weight percent of said magnesium aluminosilicate in said composition is between 5 and 20.

11. The composition of claim 6 wherein the weight percent of said magnesium oxide in said composition is between 1 and 50.

12. The composition of claim 6 wherein the weight percent of said silica in said composition is between 10 and 40, the weight percent of said alumina in said composition is between 10 and 40, the weight percent of said boron nitride in said composition is between 1 and 10, the weight percent of said magnesium aluminosilicate in said composition is between 5 and 20, and the weight percent of said magnesium oxide in said composition is between 1 and 50.

13. The composition of claim 1 wherein the weight percent of said silicon carbide in said composition is at least 10.

14. The composition of claim 1 wherein the weight percent of said silicon carbide in said composition is between 30 and 70.

15. The composition of claim 1 wherein said encapsulating resin comprises epoxy resin.