Means of enhancing laser processing efficiency of metals

• US 4,857,699 A
• Filed: 01/30/1987
• Issued: 08/15/1989
• Est. Priority Date: 01/30/1987
• Status: Expired due to Fees

• Current Assignee: ArcelorMittal Tailored Blanks Americas Ltd.
• Original Assignee: Grant Kinsman, Walter W. Duley
• Inventors: Duley, Walter W., Kinsman, Grant
• Primary Examiner(s): ALBRITTON, CLARENCE
• Application Number:
  US07/008,656
• Time in Patent Office: 928 Days
• Field of Search: 219/121 L, 219/121 LM, 219/121 LS, 219/121 LA, 219/121 LB, 219/121 LG, 219/121 LN, 219/121 LH, 219/121 LJ, 219/121 LC, 219/121 LD , 219/121.6, 219/121.85, 219/121.61, 219/121.62, 219/121.76, 219/121.67, 219/121.72, 219/121.68, 219/121.69, 219/121.63, 219/121.6 4
• US Class Current: 219/121.85
• CPC Class Codes: B23K 26/60 Preliminary treatment
• CPC Class Codes: B23Q 35/128 Sensing by using optical means

Abstract

A method is described of enhancing the efficiency of laser processing of metals by preprocessing with another laser so as to define a track of reduced reflectivity.

Claims

1. A method of preparing the surface of a material for subsequent processing by radiation of a first laser of a first wavelength by direction radiation of a second laser of a second wavelength, different from said first wavelength, to impinge upon said surface and decrease the reflectivity thereof to radiation of said first laser, said second wavelength being shorter than said first wavelength, and said second laser producing pulses of radiation.

2. A method of preparing a surface of a workpiece for subsequent working by a first laser operating at a first wavelength to enhance the coupling between said first laser and said surface, said method comprising the steps of establishing areas of the workpiece to be worked, irradiating those areas with a second laser operating at a second and different wavelength from said first wavelength and second laser exhibiting a significantly reduced reflectivity at said surface compared with said first laser wavelength and thereby decreasing the reflectivity of said surface to radiation of said first wavelength in said areas, whereby the efficiency of subsequent working of said first laser in said areas is improved.

3. A method according to claim 2 wherein said second wavelength is shorter than said first wavelength.

4. A method according to claim 2 wherein said second laser produces pulses of radiation.

5. A method according to claim 4 wherein relative movement is induced between said surface and radiation of said second laser and said successive pulses of radiation of overlap on said surface.

6. A method according to claim 2 wherein said surface is physically altered by said second laser radiation.

7. A method according to claim 2 wherein impingement of said second laser radiation promotes chemical change of said surface.

8. A method according to claim 7 wherein oxidation of said surface is promoted by said second laser.

9. A method according to claim 8 wherein impringement by said second laser occurs in an oxygen rich environment.

10. A method according to claim 3 wherein said material is metal.

11. A method according to claim 10 wherein said material is selected from the group comprising copper, aluminum, brass, silver, titanium and stainless steels.

24. A method according to claim 6, wherein the roughness of said surface in said areas is increased.

12. A method of processing a material by a first laser emitting radiation of a first wavelength by directing radiation of a second wavelength emitted from a second laser to an area of the surface of the material to be processed to reduce the reflectivity of that area to radiation of first wavelength and subsequently directing radiation from said first laser to said area to process said material,

translating said material during impingement by said second laser to impart a pattern of reduced reflectivity on the surface of said material, and

applying a mask to said surface, said mask having an aperture therein corresponding to the pattern to be produced on said surface wherein radiation of said second wavelength impinging on said surface passes through aperture.

13. A method of laser working a workpiece by a first laser operating at a first wavelength, said method comprising the steps of establishing areas of the surface of the workpiece to be worked, irradiating those areas with a second laser operating at a second and different wavelength to said first wavelength, said second laser exhibiting a significantly reduced reflectivity at said surface compared with said first laser and thereby decreasing the reflectivity of said surface to radiation of said first wavelength in said areas and, subsequent to formation of said areas of reduced reflectivity, irradiating those areas by said first laser to work said workpiece, said areas of reduced reflectivity enhancing coupliing between said first laser and said workpiece.

14. A method according to claim 13 wherein said surface is physically altered by said second layer radiation.

15. A method according to claim 13 wherein impingement of said second laser radiation promotes chemical change of said surface.

16. A method according to claim 14 wherein oxidation of said surface is promoted by said second laser.

17. A method according to claim 15 wherein impingment by said second laser on said surface occurs in an oxygen rich environment.

22. A method according to claim 13 wherein the process performed by said first laser is welding.

23. A method according to claim 13 wherein the process performed by said first laser is heat treatment.

25. A method according to claim 14, wherein the roughness of said surface in said areas is increased.

18. A method according to clai 13 including the step of translating said material during impingement by said second laser to impart a pattern of reduced reflectivity on the surface of said material.

19. A method according to claim 18 including the step of following said pattern with said first laser.

20. A method according to claim 18 wherein a mask is applied to said surface, said mask having an aperture therein corresponding to the pattern to be produced on said surface wherein radiation of second wavelength impinging on surface passes through aperture.

21. A method according to clam 13 wherein the process performed by said first laser is cutting.

26. A method of preparing the surface of a material for subsequent processing by radiation of a first laser of a first wavelength by directing radiation of a second laser of a second wavelength different from said first wavelength to impringe upon said surface and decrease the reflectivity thereof to radiation of said first laser, said second wavelength being shorter than said first wavelength, and said material being a metal selected from the group comprising copper, aluminum, brass, silver, titanium, and stainless steel.

27. A method of processing a material by a first laser emitting radiation of a first wavelength by directing radiation of a second wavelength emitted from a second laser to an area of the surface of the material to be processed to reduce the reflectivity of that area to radiation of first wavelength and subsequently direction radiation from said first laser to said area to process said material, and the process performed by said first laser being welding.