Method of and apparatus for mounting chips

• US 4,868,979 A
• Filed: 01/06/1989
• Issued: 09/26/1989
• Est. Priority Date: 05/24/1988
• Status: Expired due to Term

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Fukushima, Hiroshi, Fukai, Kikuji
• Primary Examiner(s): Eley, Timothy V.
• Assistant Examiner(s): Arbes, Carl J.
• Application Number:
  US07/294,759
• Time in Patent Office: 263 Days
• Field of Search: 29/840, 29/740, 29/834, 29/741, 228/179
• US Class Current: 29/840
• CPC Class Codes: H05K 13/0482 using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

A method of mounting chips on a circuit board having a plurality of divided regions provided thereon comprising the steps of: forcibly delivering chips housed bulky in a housing container composed of a plurality of containers by delivering means to housing recesses provided on a template in positions corresponding to positions where the chips are mounted on the circuit board; moving a chip transfer means over the circuit board, the transferring means provided for transferring the chips housed in the housing recesses to the circuit board while the chips are held in same positions as they are delivered by the guide means; loading the circuit board on a base; and shifting the circuit board successively along multiple divided regions provided on the circuit board to the position of the housing recesses by means of a chip shifting means so that the chips can be mounted on the multiple divided regions. The apparatus for carrying out the method is disclosed.

Claims

1. A method of mounting chips on a circuit board having a plurality of divided regions provided thereon comprising the steps of:

(a) forcibly delivering chips housed bulky in a housing container composed of a plurality of containers by delivering means to housing recesses provided on a template in positions corresponding to positions where the chips are mounted on the circuit board;

(b) moving a chip transfer means over the circuit board, the chip transfer means provided for transferring the chips housed in the housing recesses to the circuit board while the chips are held in the same positions as they are delivered by the delivering means;

(c) loading the circuit board on a circuit board holding means; and

(d) shifting the circuit board successively along multiple divided regions provided on the circuit board to the position of the housing recesses by means of a chip shifting means so that the chips can be mounted on the multiple divided regions.

2. An apparatus for mounting chips on a printed circuit having multiple divided regions provided thereon comprising:

a housing means composed of a plurality of containers housing therein chips in bulk;

a delivering means composed of a plurality of chutes, each delivering means being connected to the housing means at the end thereof;

a pattern base having couplings implanted therein, each coupling being connected to the other end of each delivering means;

a template being insertable under the pattern base and having housing recesses for temporarily housing chips delivered from the delivering means;

a vacuum means provided under the pattern base for drawing the chips housed in the housing container to the housing recesses when the template is inserted under the pattern base;

a chip transfer means composed of a suction pipe connectable to the vacuum means and a suction unit which is movable between the template and the circuit board for transferring the chips from the housing recesses to the circuit board;

a circuit board holding means for holding the board on a base thereof and including a divided region shifting means for shifting multiple divided regions provided on the circuit board to the position of the housing recesses for successively mounting the chips transferred by the transfer means on the multiple divided regions of the circuit board.

3. An apparatus for mounting chips on a circuit board according to claim 2, wherein the divided region shifting means comprises a first table for holding the base of the circuit board holding means slidable thereon in the X direction, a second table for holding thereon the first table slidable in the Y direction, and driving means for driving the base and the first table respectively along the first and the second tables.

4. An apparatus for mounting chips on a circuit board according to claim 2, wherein the divided region shifting means comprises only one table for holding the base of the circuit board holding means slidable thereon in Y direction while the chip transfer means movable in X direction.

5. An apparatus for mounting chips on a circuit board according to claim 2, wherein the divided region shifting means comprises only one table for holding the base of the circuit board holding means slidable thereon in one direction.