Sealing glass composition with filler containing Fe and W partially substituted for Ti in PbTiO.sub.3 filler

• US 4,883,777 A
• Filed: 04/05/1989
• Issued: 11/28/1989
• Est. Priority Date: 04/07/1988
• Status: Expired due to Fees

• Current Assignee: Nippon Electric Glass Company Limited
• Original Assignee: Nippon Electric Glass Company Limited
• Inventors: Yamanaka, Toshio
• Primary Examiner(s): BELL, MARK LEE
• Application Number:
  US07/333,450
• Time in Patent Office: 237 Days
• Field of Search: 501/15, 501/17, 501/32
• US Class Current: 501/15
• CPC Class Codes: C03C 14/004 the non-glass component being in the form of particles or flakes
• CPC Class Codes: C03C 2214/04 Particles; Flakes
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

A sealing glass composition suitable for sealing members in semiconductor devices at a temperature below about 450° C. and a comparatively low thermal expansion coefficient of about 35-50×10^-7 /°C. matching that of semiconductors. The sealing glass composition comprises 50-80 vol % solder glass powder and 20-50 vol % filler powder of a ceramic comprising, by weight, PbO 65-75%, TiO₂ 10-25%, Fe₂ O₃ 1-10%, WO₃ 1-12%, and CaO 0-5%, so that Ti in the PbTiO₃ filler is partially substituted by Fe and W. The filler powder has an average particle size of about 5 μm. In use of the sealing glass composition, microcracks are absent in glass phase around the filler after sealing.

Claims

1. In a sealing glass composition, as used for sealing members in electronic parts, consisting of a mixture which comprises solder glass powder of a low melting temperature and low expansion coefficient filler powder, the improvement wherein said filler powder comprises a ceramic powder which consists, by weight, of PbO 65-75 %, TiO₂ 10-25%, Fe₂ O₃ 1-10%, WO₃ 1-12%, and CaO 0-5%.

2. A sealing glass composition as claimed in claim 1, wherein said filler powder is 20-50 vol. % of the total amount of said composition.

3. A sealing glass powder as claimed in claim 1, wherein said filler powder has an average particle size of about 5 μ

m.

4. A sealing glass composition as claimed in claim 1, wherein said mixture further comprises at least one of zircon powder, tin material powder, B-eucryptite powder, cordierite powder, willemite powder, an d mullite powder as additional filler powder.