Aligner bonder

• US 4,899,921 A
• Filed: 10/28/1988
• Issued: 02/13/1990
• Est. Priority Date: 10/28/1988
• Status: Expired due to Term

• Current Assignee: Shinkawa Ltd. (Yamaha Corporation)
• Original Assignee: American Optical Corporation
• Inventors: Bendat, Zvi, Leggett, David A.
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US07/263,709
• Time in Patent Office: 473 Days
• Field of Search: 228/105, 228/180.2, 228/6.2, 358/101
• US Class Current: 228/105
• CPC Class Codes: H01L 21/681 using optical controlling means

Abstract

An aligner bonder for joining parts of a miniature semiconductor component, for example, comprises supports for holding the parts with surfaces facing, positioning provisions for adjusting relative positions and inclinations of the parts and for bringing the facing surfaces together for bonding. A first inclined two-sided mirror directs light from a pair of illuminators to the surfaces. Images of the surfaces are diverted from the inclined reflective mirror faces to optical paths and then to video cameras. Individual video circuitry and illuminator adjustments permit adjustment of each video image. The images are combined in a single video image displayed on a monitor. The supports for the parts are positionally adjusted to bring the video images into alignment. To adjust parallelism, autocollimators and associated reference image cross hairs project reference images via another inclined two-sided mirror to the surfaces of the parts or parallel reference surfaces. The reference image projected to the surfaces are reflected back to the video cameras via the reflective faces of the second two-sided mirror and associated optical paths. The positional relationship of the two reference images, as they appear in a combined video display are indicative of the relative inclination of the surfaces and can be adjusted to bring the surfaces parallel before retracting the probe from between the surfaces, bringing together the surfaces and bonding the parts.

Claims

1. An aligning and bonding tool for use in aligning and bonding locations on facing surfaces of parts of a miniaturized electronic component, comprising a first support means for supporting a first of said parts, second support means for supporting a second of said parts with the surface thereof facing the surface of the first part, means for controlling relative positioning of the first and second support means, an optical probe for movement into a position between the facing surfaces of the parts, illumination means for lighting each of the facing surfaces, optical means for directing an optical image of each of the facing surfaces away from the probe, and video means responsive to the optical images for combining the optical images of the facing surfaces into a single video image, whereby the means for controlling relative positioning of the first and second support means effects relative positioning of the video representation of the facing surface locations to be aligned to enable visual alignment of locations of the facing surfaces.

2. An aligning and bonding tool according to claim 1 wherein the means for controlling positioning further comprises means for bringing the aligned locations of the facing surfaces together to be connected.

3. An aligning and bonding tool according to claim 1 wherein the illumination means comprises a pair of light sources and the optical means comprises means for directing light from the light sources to the surfaces along portions of a pair of optical paths on which the images of the surfaces are returned towards the video means.

4. An aligning and bonding tool according to claim 1 wherein the video means comprises a pair of video cameras located to receive the surface images from the optical probe via the optical means, video mixing means for combining video signals corresponding to the images of the two surfaces, and a monitor for displaying the combined video images of the surfaces.

5. An aligning and bonding tool according to claim 4 wherein the video means further comprises first and second video adjusting means operatively connected to the first and second cameras, respectively, for providing individual video image adjustment of the video signals corresponding to each of the surface images.

6. An aligning and bonding tool according to claim 1 wherein the optical means comprises an inclined, two-sided mirror means on the probe at a location aligning with the locations on the first and second support means for the first and second parts, and means for receiving images reflected from reflective first and second sides of the two-sided mirror and directing the images towards the video means.

7. An aligning and bonding tool according to claim 6 wherein the means for receiving images reflected from the two-sided mirror are mirrors located to receive light from the illumination means and direct the light to the two-sided mirror, the two-sided mirror being located to reflect light from the first and second reflective surfaces thereof to the facing surfaces of the parts on the first and second support means on a path substantially perpendicular to the facing surfaces.

8. An aligning and bonding tool according to claim 1 further comprising means for projecting first and second reference images to the surfaces of parts on the first and second support means, said optical means comprising means for receiving the first and second projected reference images from the first and second surfaces and directing the reflected reference images to the video means, whereby the relationship of the reference images in a combined video image is dependent upon the relative inclination of one of the surfaces with respect to the other of the surfaces adjustable by the means for controlling relative positioning of the support means.

9. An aligning and bonding tool according to claim 8 wherein the means for projecting first and second reference images comprises a pair of autocollimators, a pair of image producing means in the path of collimated light from the autocollimators and means for directing the collimated light and the images of the image producing means to surfaces indicative of the inclination of surfaces of the parts to be joined on the support means.

10. An aligning and bonding tool according to claim 9 wherein the image producing means comprise means for producing cross hair images, the means for producing cross hair images being located in the path of autocollimated light such that video images of the cross hair images appear coincident in the combined video image when the facing surfaces of the parts are parallel.

11. An aligning and bonding tool according to claim 10 wherein the means for projecting first and second reference images comprises inclined two-sided mirror means on the probe at a location aligning with the locations on the first and second support means for the first and second parts, and means for directing the first and second reference images and collimated light to reflective first and second sides of the two-sided mirror.

12. An aligning and bonding tool according to claim 11 wherein the means for directing the first and second reference images and collimated light to reflective first and second sides of the two-sided mirror are mirrors located to direct light to first and second sides of the two sided mirrors, to receive the reference images on the indicative surfaces from the reflective first and second sides of the two-sided mirror, and to direct the reference images to the video means.

13. An aligner bonder for aligning and bonding regions of facing surfaces of parts of a semiconductor component such as an integrated circuit or the like comprising first and second video cameras, first and second individual video image adjusting circuitry means operatively connected to each of the first and second video cameras, respectively, for adjusting a video image produced by each camera, mixing means for combining image signals from the first and second video cameras, a monitor for displaying the combined video signals, first support means for supporting a first part of a semiconductor component having a first surface with regions thereon to be aligned and bonded, second support means for supporting a second part of a semiconductor component having a second surface with regions thereon to be aligned and bonded with the regions on the first part, the first and second support means supporting the first and second parts with the first and second surfaces facing each other and spaced a relatively short distance apart, optical means for transmitting first and second images from the first and second surfaces to the first and second video cameras, said optical means including a probe movable to and from a position between the first and second surfaces, and means for controlling the positioning of the first and second support means to align the regions of the first and second surfaces and to move the regions into engagement for bonding upon retraction of the probe.

14. An aligner bonder according to claim 13 wherein the optical means comprises image receiving means on the probe facing the first and second surfaces for receiving images of the first and second surfaces, and first and second optical paths from the image receiving means to the cameras, whereby a combined video image of the first and second surfaces is produced on the video monitor to display relative positioning of the regions on the first and second surfaces.

15. An aligner bonder according to claim 14 further comprising means for directing light to the first and second surfaces from the probe on paths substantially perpendicular to the surfaces.

16. An aligner bonder according to claim 13 wherein the optical means comprises reference image projecting means for projecting first and second reference images to the first and second surfaces, respectively, or reference surfaces parallel thereto, and reference image receiving means on the probe facing the first and second surfaces for receiving the first and second reference images, respectively, from the first and second surfaces or reference surfaces, reference image optical paths from the reference image receiving means to the cameras, whereby a combined video image of the first and second reference images is produced in which the relative positions of the reference images indicate the relative inclination of the first and second surfaces.

17. An aligner bonder according to claim 16 wherein the reference image projecting means comprises first and second autocollimators directing collimated light towards the first and second surfaces, and first and second reference mark image producing means, in the path of collimated light directed toward the first and second surfaces, for producing the first and second reference images.

18. The aligner bonder of claim 13 further comprising means for textually displaying data concerning the status of the aligner bonder in a window display on the monitor that displays the combined video signals.

19. A video-optical assembly for an aligner bonder comprising a probe, first and second two-sided mirror means located on the probe and each having two reflective faces inclined to reflect light directed thereto from opposite sides thereof in opposite directions therefrom, first and second pairs of mirrors located to direct light to the opposite reflective faces of the first and second two-sided mirror means and to receive images from the opposite reflective faces of the first and second two-sided mirror means, a pair of autocollimators, first and second reference image forming means in the paths of collimated light from the autocollimators, lenses in the paths of the collimated light from the autocollimators to the first pair of mirrors to provide the first and second reference images to the opposite reflective faces of the first of the two sided mirror means via the first pair of mirrors, first and second illumination means, and first and second means defining an optical path between the first and second illumination means and the second pair of mirrors to illuminate the reflective faces of the second two-sided mirror, first and second video cameras, and means for directing images to the first and second video cameras from the opposite reflective surfaces of the first and second two-sided mirror means.

20. The method of aligning for bonding the facing surfaces of first and second parts of a miniature semiconductor device comprising supporting the first and second parts with the facing surfaces thereof spaced apart, providing an optical probe having a two-sided mirror secured thereon diagonally with respect to the facing surfaces, introducing the probe between the facing surfaces, providing first and second video cameras, directing images of the surfaces from opposite reflective faces of the two-sided mirror along optical paths to the video cameras, combining outputs of the video camera, displaying a combined image of the facing surfaces on a video monitor, adjusting the relative positions of the facing surfaces until locations to be brought together are aligned in the video image, withdrawing the optical probe, moving the first and second parts together until the facing surface locations to be brought together contact, and bonding the contacting locations.

21. The method according to claim 20 further comprising the step of illuminating the facing surfaces by directing light along at least a portion of each of the optical paths to the two-sided mirror.

22. The method according to claim 20 further comprising projecting first and second reference images to the facing surfaces of the first and second parts respectively or parallel reference surfaces, directing the first and second reference images from the facing surfaces along reference image optical paths to the video cameras, displaying a combined image of the first and second reference images on the video monitor, and adjusting the relative inclination of the facing surfaces by adjusting the relationship of the reference images in the video display before moving the first and second parts together.

23. The method according to claim 22 wherein the step of directing the first and second reference images from the facing surfaces along optical paths to the video cameras comprises providing a second two-sided mirror on the optical probe diagonally positioned with respect to the facing surfaces and directing reflections of the first and second reference images on the facing surfaces or reference surfaces to the reference image optical paths.

24. The method according to claim 23 wherein the step of projecting first and second reference images comprises providing first and second autocollimators, locating first and second image forming means in the path of collimated light from the first and second autocollimators, directing the collimated light and the first and second reference images of the image forming means to the second two-sided mirror, and reflecting the first and second reference surfaces from the opposite reflective surfaces of the second two-sided mirror to the facing surfaces of the first and second parts.