Method and apparatus for encapsulating semi-conductors

  • US 4,900,501 A
  • Filed: 10/30/1986
  • Issued: 02/13/1990
  • Est. Priority Date: 11/08/1985
  • Status: Expired due to Term
First Claim
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1. In a method for producing resin-encapsulated semiconductors the steps comprising;

  • providing a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at an end of each runner, wherein a first cavity in each series located at the nearest position from a pot is connected to a runner through a gate, and each further cavity in each series is connected to each adjacent cavity in each series only through a slit formed as a flow channel in a lead frame interposed between a top part and a bottom part of said mold;

    discharging said resin from said pots into said runners such that said resin is fed only to said first cavity of each series through said gate; and

    discharging said resin from a cavity to an adjacent cavity only through said slit sequentially up to the last cavity in each series.

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