Bar-shaped magnetron or sputter cathode arrangement
First Claim
1. Bar-shaped magnetron-sputter cathode arrangement having an internal, cooled permanent magnet system and a carrier tube for a target which is deposited on the bar-shaped carrier tube, which comprises a non-magnetic steel, and which comprises appropriate different target materials, wherein at least one thermal contact layer is disposed between the carrier tube and the target, and the target comprises one or more rings shrunk onto the carrier tube, the thermal contact layer comprising a solid, highly thermally conductive metal or alloy.
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Accused Products
Abstract
The invention relates to a bar-shaped magnetron-sputter cathode arrangement having an internal, cooled permanent magnet system and a carrier tube for the target. It is provided according to the invention that at least one thermal contact layer (38) is disposed between the carrier tube (36) and the target, which consists of one or more ring(s) (37, 37'"'"', 37") shrunk, especially interchangeably, onto the carrier tube (36). During sputtering the cathode (6) and the surface to be sputtered can be subjected to a mutual relative motion in the longitudinal direction of the cathode (6), for which purpose an adjusting element is provided. The magnets (31) are disposed inside the carrier tube (36) with the magnetic fields having alternately opposing directions in the longitudinal direction of the carrier tube (36). They possess cylindrical or polygonal lateral surfaces and end faces (44) which are parallel and slope at an angle (α) to the longitudinal direction of the electrode (6) or shaft (30).
78 Citations
18 Claims
- 1. Bar-shaped magnetron-sputter cathode arrangement having an internal, cooled permanent magnet system and a carrier tube for a target which is deposited on the bar-shaped carrier tube, which comprises a non-magnetic steel, and which comprises appropriate different target materials, wherein at least one thermal contact layer is disposed between the carrier tube and the target, and the target comprises one or more rings shrunk onto the carrier tube, the thermal contact layer comprising a solid, highly thermally conductive metal or alloy.
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12. Sputtering process for sputtering with a magnetron or other type sputter cathode arrangement, such process being suitable for sputtering surfaces having curved areas such as the inner surfaces of hollow bodies, such process comprising the steps of:
relatively moving the surfaces to be sputtered and a sputtering cathode arrangement that includes a carrier tube on which different target materials are deposited, the carrier tube having a plurality of rings of different target materials shrunk thereon sequentially in the axial direction of the carrier tube, the cathode arrangement being held fixed and the surface or the body carrying the surface being moved, the cathode arrangement and the surfaces to be sputtered being subjected to a mutual relative motion in the longitudinal direction of the carrier tube of the cathode arrangement. - View Dependent Claims (13, 14)
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15. Tubular target, adapted for use with a bar-shaped magnetron or sputter cathode arrangements having a carrier tube for the target material, wherein between the carrier tube of the tubular target and the target material there is provided at least one thermal contact layer which has a thickness of about 5 μ
- m to about 50 μ
m and which comprises a solid highly thermally conductive metal having a low melting point and a hardness of <
20 MHV, at least one ring comprising an appropriate target material being mounted on the carrier tube in the axial direction, the ring being shrunk onto the carrier tube while warm and disposed with a force fit on the thermal contact layer, the metal of the thermal contact layer having a coefficient of thermal expansion which exceeds that of the target material. - View Dependent Claims (16, 17)
- m to about 50 μ
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18. Apparatus for carrying out a sputtering process with a sputter cathode arrangement:
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the sputter cathode arrangement comprising a carrier tube on which different target materials are deposited, the carrier tube having a plurality of rings of different target materials shrunk thereon sequentially and in the axial direction of the carrier tube and a thermal contact layer provided between the carrier rod and the rings, the contact layer comprising a solid, highly thermal conductive metal or alloy; and for carrying either the cathode arrangement or the surface to be sputtered, said means being formed by a carrier device which executes a reciprocating motion in the longitudinal direction of the carrier tube and which can be actuated by a driving device whereby the surface to be sputtered and the sputter cathode arrangement are relatively moved along the longitudinal direction of the carrier tube.
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Specification