Multiple circuit board module

• US 4,916,575 A
• Filed: 08/08/1988
• Issued: 04/10/1990
• Est. Priority Date: 08/08/1988
• Status: Expired due to Fees

• Current Assignee: CTS Corporation Elkhart Indiana
• Original Assignee: CTS Corporation Elkhart Indiana
• Inventors: Van Asten, Francis C.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US07/229,430
• Time in Patent Office: 610 Days
• Field of Search: 165/80.3, 165/185, 174/16.3, 357/81, 361/381, 361/386-388, 361/393-395, 361/399, 361/417, 361/419-420
• US Class Current: 361/715
• CPC Class Codes: H05K 7/20545 Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Abstract

A circuit board module which houses multiple circuit boards. The module includes a thermally conductive frame having a plurality of ribs which extend between the frame side walls. One or more support plates are secured to the frame and support the circuit boards, which contain a plurality of heat generating electronic components. The heat generated by these components is directed through the support plates to the frame for dissipation.

Claims

1. An improved standard electronic module (SEM) which comprises:

(a) a thermally conductive frame including end walls and side walls;

(b) a plurality of thermally conductive spaced ribs extending between said frame side walls;

(c) a first circuit board secured by a first securing means to said frame above said ribs between said frame side walls and said frame end walls;

(d) a second circuit board secured by a second securing means to said frame below said ribs between said frame side walls and said frame end walls;

(e) a plurality of first discrete electronic components connected to said first circuit board and positioned within spacings of said spaced ribs;

(f) a plurality of second discrete electronic components connected to said second circuit board and positioned within the spacings of said spaced ribs;

said plurality of ribs constituting means for providing vibration resistance and for conducting thermal energy generated by said plurality of first and second discrete electronic components to said thermally conductive frame.

2. The module of claim 1 wherein said frame includes a thermally conductive base extending substantially between said side walls and said end walls, said base positioned adjacent to said ribs, said second circuit board secured to said base.

3. The module of claim 2 wherein a plurality of apertures are disposed through said base, said apertures positioned to allow passage of external leads from said plurality of second discrete electronic components mounted upon said base, said external leads extending through said apertures in said base to said second circuit board.

4. The module of claim 1 wherein said first securing means comprises a first support member positioned between said side walls, said circuit board mounted on a first surface of said first support member, and a third circuit board mounted on said first support member on a second surface of said first support member opposite said first surface of said first support member.

5. The module of claim 4 wherein said second securing means comprises a second support member positioned between said side walls, said second circuit board mounted on a first surface of said second support member, and a fourth circuit board mounted on said second support member on a second surface of said second support member opposite said first surface of said second support member.

8. The module of claim 1, wherein said frame is fabricated from thermally conductive material.

9. The module of claim 1, wherein an external mounting flange extends substantially along each side wall of said frame, said mounting flange constituting means for securing said module within a housing and to dissipate heat generated by said discrete components from said frame to the housing.

6. The module of claim wherein a first cover extends in spaced relation above said plurality of first discrete components, said first cover mounted above said first circuit board for releasable securement to said side walls and said end walls, and wherein a second cover extends in spaced relation below said plurality of second discrete components for releasable securement to said side walls and said end walls.

7. The module of claim 6, wherein the first and second covers are each hermetically sealed to said side walls and said end walls.

10. An improved, multiple circuit board module which comprises:

(a) a thermally conductive frame having a connector mounting end wall, an opposite end wall, opposite side walls walls and a base extending substantially between the side walls and end walls;

(b) a plurality of thermally conductive, spaced ribs extending between the frame side walls, said spaced ribs being adjacent to the base;

(c) a first circuit board with a plurality of discrete components disposed thereon, the first circuit board secured by a securing means to the side walls of the frame;

(d) a second circuit board disposed adjacent to the base, apertures disposed through the base; and

(e) a plurality of discrete components disposed upon the base, external leads extending from the discrete components through the aperture to the second circuit board disposed adjacent to the base;

wherein the base and ribs constitute means for improving vibration resistance and thermal transfer of heat generated by the discrete electronic components to the thermally conductive frame.

11. The module of claim 10, wherein a first cover extends in spaced relation above the discrete components mounted upon the first circuit board for releasable securement to the side walls and end walls of the frame, and a second cover extends in spaced relation below the second circuit board for releasable securement to the side walls and end walls of the frame.

12. The module of claim 11, wherein the first and second covers are each hermetically sealed to the side walls and end walls of the frame.

13. The module of claim 10, wherein said securing means comprises a first support member extending between the side walls of the frame adjacent to the first circuit board, and wherein a third circuit board is disposed adjacent to the first support member on a side of the first support member opposite the first circuit board.

14. The module of claim 10, wherein the frame is fabricated from thermally conductive.

15. The module of claim 10, wherein an external mounting flange extends substantially along each side wall of the frame to aid in securement of the module within a housing, and to dissipate heat generated by the discrete components from th frame to the housing.