Soldering method capable of providing a joint of reduced thermal resistance

• US 4,927,069 A
• Filed: 07/10/1989
• Issued: 05/22/1990
• Est. Priority Date: 07/15/1988
• Status: Expired due to Term

• Current Assignee: Sanken Electric Company Limited
• Original Assignee: Sanken Electric Company Limited
• Inventors: Iwasa, Yasuhiro, Yamaji, Yukinori, Ushikubo, Takao
• Primary Examiner(s): Godici, Nicholas P.
• Assistant Examiner(s): Heinrich, Samuel M.
• Application Number:
  US07/377,906
• Time in Patent Office: 316 Days
• Field of Search: 228/123, 228/124, 228/180.2, 228/179, 228/224, 228/243, 228/248, 228/237
• US Class Current: 228/123.1
• CPC Class Codes: B23K 1/00 Soldering, e.g. brazing, or unsoldering B23K3/00 takes precedence; characterised only by the use of special materials or media B23K35/00; dip or wave soldering in the manufacture of printed circuits H05K3/34
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/26175 Flow barriers
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1301 : Thyristor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01R 43/02 : for soldered or welded connections
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 2201/10969 : Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 2203/0278 : Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 2203/1178 : Means for venting or for letting gases escape
• CPC Class Codes: H05K 3/341 : Surface mounted components
• CPC Class Codes: H05K 3/3489 : Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
• CPC Class Codes: H05K 3/3494 : Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A soldering method is disclosed as adapted for attaching semiconductor devices such as transistors to their lead mounts. A layer of a solder paste, premixed with rosin flux, is first printed or otherwise formed on each of a series of interconnected semiconductor mounts which may be in the form of a sheet metal punching. The semiconductor devices are placed on the respective solder layers. Then the solder layers are heated to a prescribed temperature higher than both the melting point of the solder and a flux activation temperature at which the flux starts bubbling within the solder. For thus heating the solder layers, the series of semiconductor mounts with the semiconductor devices placed thereon via the solder layers may be fed longitudinally over a suitably heated surface. Upon lapse of a preassigned length of time following the activation of the flux, a compressive is exerted on the successive solder layers, thereby driving of the gas bubbles generated by the flux for the provision of joints of reduced thermal resistance.

Claims

1. A method of soldering two members together, which comprises:

(a) placing a body of solder together with a flux between the two members;

(b) heating the solder and the flux to a prescribed temperature above the melting point of the solder and above a flux activation temperature at which the flux generates a gas;

(c) maintaining the solder and the flux at the prescribed temperature for a preassigned length of time; and

(d) exerting a compressive force on the solder through at least either of the two members in order to drive off the gas bubbles generated by the flux from the molten body of solder and hence to provide a joint of reduced thermal resistance.

2. A method of soldering two members together, which comprises:

(a) placing a body of solder together with a flux between the two members;

(b) heating the solder and the flux to a prescribed temperature above the melting point of the solder and above a flux activation temperature at which the flux generates a gas;

(c) maintaining the solder and the flux at the prescribed temperature for a preassigned length of time, with the solder held only under the weight of one of the two members in order to avoid a decrease in the thickness of the molten body of solder and hence to expedite the escape of the gas bubbles generated by the flux from the molten body of solder; and

(d) exerting a compressive force on the solder through at least one of the two members in order to drive off the remaining gas bubbles from the molten body of solder and to reduce the thickness of the solder body, with a view to the provision of a soldered joint of reduced thermal resistance.

3. The soldering method of claim 2 wherein the compressive force is exerted on the molten body of solder to the last moment when the solder is in a molten state, allowing the solder body to solidify with its reduced thickness unchanged.

4. The soldering method of claim 2 wherein the exertion of the compressive force is terminated when the solder body is still in a molten state, thereby allowing the solder body to re-increase its thickness before being allowed to solidify.

5. The soldering method of claim 4 which further comprises exerting an expansive force on the molten solder body after the exertion of the compressive force thereon, thereby causing a greater increase in its thickness.

6. A method of soldering two members together, which comprises:

(a) placing a body of solder together with a flux between the two members;

(b) heating the solder and the flux to a prescribed temperature above the melting point of the solder and above a flux activation temperature at which the flux generates a gas;

(c) maintaining the solder and the flux at the prescribed temperature for a preassigned length of time, with the solder held only under the weight of one of the two members in order to avoid a decrease in the thickness of the molten body of solder and hence to expedite the escape of the gas bubbles generated by the flux from the molten body of solder;

(d) exerting a compressive force on the solder through at least one of the two members during a preassigned part of the preassigned length of time when the solder is maintained at the prescribed temperature, in order to drive off the remaining gas bubbles from the molten body of solder and to reduce the thickness of the solder body;

(e) releasing the compressive force from the solder before expiration of the preassigned length of time in order to allow the molten body of solder to re-increase in thickness; and

(f) re-exerting a compressive force on the solder through at least one of the two members when the solder is in a molten state, in order to additionally drive off the remaining gas bubbles from the molten body of solder and to reduce the thickness of the solder body again, with a view to the provision of a soldered joint of reduced thermal resistance.

7. The soldering method of claim 6 wherein the solder body is allowed to cool during the re-exertion of the compressive force, with its reduced thickness unchanged.

8. The soldering method of claim 6 wherein the re-exertion of the compressive force is terminated when the solder body is in a molten state, thereby allowing the solder body to re-increase its thickness before being allowed to solidify.

9. The soldering method of claim 6 wherein the compressive forces exerted and re-exerted on the solder during its molten state are of the same magnitude.

10. A method of soldering semiconductor devices to their mounts, which comprises:

(a) providing a series of interconnected semiconductor mounts having solderable surfaces;

(b) forming layers of a solder paste on the solderable surfaces of the semiconductor mounts, the solder paste containing a flux;

(c) placing the semiconductor devices on the solder paste layers;

(d) heating the solder paste layers to a prescribed temperature above the melting point of the solder paste and above a flux activation temperature at which the flux generates a gas, by feeding the series of semiconductor mounts, together with the semiconductor devices placed thereon via the solder paste layers, longitudinally over a heating apparatus; and

(e) exerting a compressive force on the successive solder paste layers via the semiconductor devices thereon while the solder paste layers are in a molten state, thereby driving off the gas bubbles generated by the flux from the solder paste layers and hence to provide joints of reduced thermal resistance between the semiconductor devices and their mounts.

11. The soldering method of claim 10 wherein the heating apparatus has an entrance end and an exit end, and wherein the compressive force is applied by a push member disposed next to the exit end of the heating apparatus, thereby allowing the solder paste layers to solidify with their thickness reduced by the compressive force.

12. The soldering method of claim 10 wherein the heating apparatus has an entrance end and an exit end, and wherein the compressive force is applied by a push member disposed intermediate the entrance end and exit end of the heating apparatus, thereby allowing the solder paste layers to re-increase their thickness upon release of the compressive force.

13. The soldering method of claim 10 wherein the compressive force is exerted twice on each solder paste layer by first and second push members disposed in preassigned positions with respect to the heating apparatus and spaced from each other in the traveling direction of the series of semiconductor mounts over the heating apparatus.

14. The soldering method of claim 13 wherein the heating apparatus has an entrance end and an exit end, and wherein the second push member, disposed downstream of the first push member with respect to the traveling direction of the series of semiconductor mounts over the heating apparatus, is disposed next to the exit end of the heating apparatus for allowing the solder paste layers to solidify with their thickness reduced by the compressive force.

15. The soldering method of claim 13 wherein the heating apparatus has an entrance end and an exit end, and wherein the first and second push members are both disposed intermediate the entrance end and exit end of the heating apparatus for allowing the solder paste layers to re-increase their thickness before being allowed to solidify.