Multilayer printed circuit board with pseudo-coaxial transmission lines

• US 5,003,273 A
• Filed: 12/04/1989
• Issued: 03/26/1991
• Est. Priority Date: 12/04/1989
• Status: Expired due to Term

• Current Assignee: ITT Corporation (ITT, Inc.)
• Original Assignee: ITT Corporation (ITT, Inc.)
• Inventors: Oppenberg, George A.
• Primary Examiner(s): GENSLER, PAUL L
• Application Number:
  US07/445,806
• Time in Patent Office: 477 Days
• Field of Search: 333/1, 333/238, 333/243, 174/36, 174/117 FF
• US Class Current: 333/1
• CPC Class Codes: H01P 3/088 Stacked transmission lines
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09236 Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes parallel traces in one plane H05K2201/09236

Abstract

A multilayer printed circuit board has a plurality of planar layers formed with signal conductor lines and return lines grouped around the conductor lines to form pseudo-coaxial transmission lines. The return lines are grouped symmetrically around each signal line, e.g. two, four, or eight return lines at circumferential positions around each signal line. Ground and power planes may be formed with the multilayer structure for shielding and/or for powering electronic components mounted on the structure. The multilayer techniques can also be used to form a multilayer extender card which minimizes crosstalk and is reduced in cost and assembly time as compared to conventional extender boards.

Claims

1. A multilayer printed circuit board comprising:

a plurality of planar layers made of dielectric material extending in parallel with each other in lateral and depthwise directions, said planar layers being formed one on top of the other in a vertical direction, at least one of said planar layers having signal conductor lines made of conductive material formed at spaced positions from each other in the lateral direction and extending in parallel with each other in the depthwise direction, and other ones of said planar layers above and below said at least one of said planar layers having return lines made of conductive material formed at spaced positions from each other in the lateral direction and extending in parallel with each other in the depthwise direction,

wherein said return lines are grouped around associated ones of said signal conductor lines so as to form pseudo-coaxial transmission lines therewith; and

wherein said return lines are formed within said other ones of said planar layers spaced from each other and from the associated signal conductor line so as to be insulatively separated therefrom by said dielectric material of said planar layers.

2. A multilayer printed circuit board according to claim 1, wherein the return lines are grouped in position symmetrically around each signal conductor line.

3. A multilayer printed circuit board according to claim 2, including at least four return lines for each signal conductor line, wherein the signal conductor lines are formed in one layer, and the at least four return lines are formed with two return lines in side positions in each of an upper and a lower layer above and below said one layer, respectively.

4. A multilayer printed circuit board according to claim 3, including eight return lines for each signal conductor line, with three return lines in center and side positions in each of said upper and lower layers, and two return lines in said one layer on each side of said signal conductor line.

5. A multilayer printed circuit board according to claim 1, including at least one plane made of conductive material formed with said plurality of layers.

6. A multilayer printed circuit board according to claim 1, including a plane made of conductive material formed on each external side of said plurality of layers.

7. A multilayer printed circuit board according to claim 1, wherein said signal conductor lines and return lines are formed in two or more horizontal rows one on top of the other.

8. A multilayer printed circuit broad according to claim 1, wherein said at least one planar layer having said signal conductor lines further includes return lines formed at spaced positions from and extending in parallel with associated ones of said signal conductor lines.

9. A multilayer printed circuit board comprising:

a plurality of planar layers made of dielectric material extending in parallel with each other in lateral and depthwise directions, said planar layers being formed one on top of the other in a vertical direction, at least one of said planar layers having signal conductor lines made of conductive material formed at spaced positions from each other in the lateral direction and extending in parallel with each other in the depthwise direction, and other ones of said planar layers above and below said at least one of said planar layers having return lines made of conductive material formed at spaced positions from each other in the lateral direction and extending in parallel with each other in the depthwise direction,

wherein said return lines are grouped around associated ones of said signal conductor lines so as to form pseudo-coaxial transmission lines therewith; and

intermediate insulating layers made of dielectric material extending in parallel with said planar layers in the lateral and depthwise directions, each of which is interposed between adjacent ones of said planar layers containing said signal conductor lines and said return lines so as to insulatively separate said lines from each other.

10. A multilayer printed circuit board comprising:

a plurality of planar layers made of dielectric material formed one on top of the other in a vertical direction having signal conductor lines made of conductive material formed at spaced positions and return lines made of conductive material formed at spaced positions in parallel with and in spaced relation around associated ones of said signal conductor lines so as to form pseudo-coaxial transmission lines therewith; and

an external plane made of conductive material formed on each external side in the vertical direction of said plurality of planar layers, wherein at least one of said external planes is a power plane connected to a power source for supplying power to electronic components to be mounted on said power plane.

11. A multilayer printed circuit board comprising:

a plurality of planar layers made of dielectric material formed one on top of the other having signal conductor lines made of conductive material formed at spaced positions and return lines made of conductive material formed at spaced positions in parallel with and in spaced relation around associated ones of said signal conductor lines so as to form pseudo-coaxial transmission lines therewith; and

at least one internal plane made of conductive material formed in a central position within said plurality of planar layers.

12. A multilayer printed circuit board according to claim 11, including a power plane and a return plane made of conductive material in parallel in the central position of said plurality of layers.

13. A multilayer printed circuit board according to claim 12, wherein said signal conductor lines and return lines are formed in two or more horizontal rows positioned above and below said power and return planes.

14. A multilayer printed circuit board according to claim 11, further including an external ground plane made of conductive material formed on each external side of said plurality of planar layers.

15. A multilayer printed circuit board according to claim 11, wherein said signal conductor lines and return lines have their ends connected to connector pins of a connector.