Method of producing IC cards

• US 5,026,452 A
• Filed: 08/31/1989
• Issued: 06/25/1991
• Est. Priority Date: 12/11/1986
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Kodai, Syojiro
• Primary Examiner(s): Dawson, Robert A.
• Assistant Examiner(s): Kuhns, Allan R.
• Application Number:
  US07/401,520
• Time in Patent Office: 663 Days
• Field of Search: 156/108, 156/293, 156/295, 40/360, 283/107, 283/108, 283/904, 264/276
• US Class Current: 156/293
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 283/904 Credit card

Abstract

A method of producing an IC card in which an IC module is embedded, the method including preparing at least one first resin core sheet having a through hole at a position at which the IC module is to be embedded and at least one second resin core sheet having no hole at a position corresponding to the through hole, disposing adhesive sheet having an area greater than that of the through hole on the first resin core sheet covering the through hole, superposing the first and second resin core sheets with the adhesive sheet therebetween, fitting the IC module into the through hole of the first resin core sheet, heating and pressing the IC module and the resin core sheets to form an integral structure, and applying at least one surface protection sheet to the integral structure to complete the card.

Claims

1. A method of making a card in which an IC module is embedded comprising:

preparing at least two similar resin core sheets by forming a through hole in at least a first of said resin core sheets in which an IC module may be disposed, at least a second of said resin core sheets not containing a through hole;

disposing a thermally softenable adhesive sheet having an area that is smaller than that of said core sheets and larger than that of said through hole and having a shape that covers said through hole to cover said through hole in said first resin core sheet;

bringing said first and second resin core sheets into contact with each other with said adhesive sheet therebetween covering said through hole;

inserting an IC module into said through hole;

heating said resin core sheets and said adhesive sheet to soften said adhesive sheet and pressing said resin core sheets, said adhesive sheet, and said IC module so that said softened adhesive sheet flows between said first and second core sheets toward the through hole to fill voids, if any, between the through hole and said IC module and away from the through hole to form an integral structure;

applying at least one surface protection sheet to a side of said integral structure; and

heating and pressing said protection sheet and said integral structure to adhere said

2. The method of making a card according to claim 1 including a plurality of said first resin core sheets, each having a through hole in which said IC module is to be disposed, including aligning the through holes in said plurality of first resin core sheets to form a recess for receiving said IC module wherein the adhesive sheet flows between the second core sheet and the adjacent first core sheet.

3. The method of making a card according to claim 1 including applying a surface protection sheet to each side of said integral structure and heating and pressing said protection sheets and said integral structure to complete said card.

4. The method of making a card according to claim 1 wherein said at least one protection sheet includes a through hole and including aligning said through hole in said protection sheet with said through hole in said first resin core sheet before heating and pressing said protection sheet and said integral structure.

5. The method of making a card according to claim 1, wherein said adhesive sheet is a heat-sensitive adhesive sheet.

6. The method of making a card according to claim 1, wherein said adhesive sheet is thermosetting adhesive sheet in a semi-hardened state.

7. The method of making a card according to claim 1 comprising, before said step of superposing said at least one surface protection sheet, printing a design on the side of said resin core sheet where said surface protection sheet is to be applied.

8. The method of making a card according to claim 7 wherein said adhesive sheet is a heat-sensitive adhesive sheet.

9. The method of making a card according to claim 7 wherein said adhesive sheet is a thermosetting adhesive sheet in a semi-hardened state.