Sealing glass composition and electrically conductive formulation containing same

• US 5,066,621 A
• Filed: 06/21/1990
• Issued: 11/19/1991
• Est. Priority Date: 06/21/1990
• Status: Expired due to Term

• Current Assignee: Honeywell International Inc.
• Original Assignee: Johnson Matthey Incorporated (Johnson Matthey PLC)
• Inventors: Akhtar, Masyood
• Primary Examiner(s): Dixon, Jr., William R.
• Assistant Examiner(s): JONES, DEBORAH D
• Application Number:
  US07/541,605
• Time in Patent Office: 516 Days
• Field of Search: 501/41, 501/46, 501/47, 501/49, 501/51, 501/32, 106/1.14
• US Class Current: 501/41
• CPC Class Codes: C03C 3/12 Silica-free oxide glass compositions
• CPC Class Codes: C03C 8/18 containing free metals
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H01B 1/16 the conductive material comprising metals or alloys
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/4828 Conductive organic material or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

Described is a sealing glass composition comprising, in wt. %, 13-50% lead oxide, 20-50% vanadium oxide, 2-40% tellurium oxide, up to 40% selenium oxide, up to 10% phosphorous oxide, up to 5% niobium oxide, up to 20% bismuth oxide, up to 5% copper oxide and up to 10% boron oxide and an electrically conductive formulation comprising, in wt. %, 50-77% silver, 8-34% of a sealing glass composition as described previously, 0.2-1.5% resin and thixotrope and 10-20% organic solvent.

Claims

1. A sealing glass composition comprising, in wt. %, 13-50% lead oxide, 20-50% vanadium oxide, 2-40% tellurium oxide, up to 40% selenium oxide, up to 20% bismuth oxide, up to 10% phosphorous oxide, up to 5% niobium oxide, up to copper oxide and up to 10% boron oxide.

2. A sealing glass composition according to claim 1 wherein tellurium oxide is present in the amount of 9-30%.

3. A sealing glass composition according to claim 1 wherein bismuth oxide is present in the amount of 1-5%.

5. A sealing glass composition according to claim 1 wherein the combined amount of tellurium oxide and selenium oxide is in the range of 2-40%.

4. A sealing glass composition according to claim wherein the total amount of niobium oxide, phosphorous oxide, copper oxide and boron oxide does not exceed 10%.

6. A sealing glass composition comprising, in wt. %, 30-50% lead oxide, 30-50% vanadium oxide, 9-30% tellurium oxide, from 2 to 40% of tellurium oxide and selenium oxide, 1-5% bismuth oxide and up to 10% of one or more of niobium oxide, phosphorous oxide, copper oxide and boron oxide.

7. A silver glass paste suitable for use in bonding a semi-conductor device to a ceramic substrate comprising, in wt. %, 50-77% silver;

8-34% of a sealing glass composition comprising 13-50% lead oxide, 20-50% vanadium oxide, 2-40% tellurium oxide, up to 40% selenium oxide, up to 10% phosphorous oxide, up to 5% niobium oxide, up to 20% bismuth oxide, up to 5% copper oxide, up to 10% boron oxide;

0.2-1.5% resin and thixotrope and 10-20% organic solvent.

8. A silver glass paste according to claim 7 wherein said silver comprises silver in flake form and up to 10% silver in powder form.

9. A silver glass paste according to claim 7 wherein tellurium oxide is present in the sealing glass composition in the amount of 9-30%.

10. A silver glass paste according to claim 7 wherein bismuth oxide is present in the sealing glass composition in the amount of 1-5%.

11. A silver glass paste according to claim 7 wherein the total amount of niobium oxide, phosphorous oxide, copper oxide and boron oxide in the sealing glass composition does not exceed 10%.

12. A silver glass paste according to claim 7 wherein the combined amount of tellurium oxide and selenium oxide is in the sealing glass composition is in the range of 2-40%.

13. A silver glass paste according claim 7 wherein the sealing glass composition comprises, in wt. %, 30-50% lead oxide, 30-50% vanadium oxide, 9-30% tellurium oxide, 2 to 40% total tellurium oxide and selenium oxide, 1-5% bismuth oxide and up to 10% of one or more of niobium oxide, phosphorous oxide, copper oxide and boron oxide.