Method of bonding leads to semiconductor elements

• US 5,094,382 A
• Filed: 03/14/1991
• Issued: 03/10/1992
• Est. Priority Date: 03/14/1990
• Status: Expired due to Term

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Shimizu, Nagao
• Primary Examiner(s): Seidel, Richard K.
• Assistant Examiner(s): Knapp, Jeffrey T.
• Application Number:
  US07/669,567
• Time in Patent Office: 362 Days
• Field of Search: 228/103, 228/102, 228/9, 228/180.2, 228/49.1, 29/834
• US Class Current: 228/102
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67138 Apparatus for wiring semiconductor or solid state device
• CPC Class Codes: Y10T 29/49133 with component orienting

Abstract

A method for sequentially bonding semiconductor elements to leads formed on TAB type carrier is disclosed. The method provides for the use of the difference between pre and post bonding position recognition values to correct relative pre-positioning of leads and electrodes in successive bonding cycles by sequential learning and thereby obtain improved correction of position slippages between leads and electrodes during bonding.

Claims

1. A method of successive bonding cycles each comprising the bonding of semiconductor elements to leads provided on a carrier film by obtaining a position correction value based upon the difference between recognized pre-bonding and post-bonding positions established during a bonding cycle and comprising:

a. providing a long carrier film having a plurality of leads and a plurality of locations for receiving a semiconductor element;

b. providing a semiconductor element having electrodes;

c. positioning said carrier film and semiconductor element for bonding of said leads to said electrodes at a selected one of said locations;

d. correcting the relative positioning of said electrodes and leads in step c based on a previously determined position correction value;

e. detecting the relative pre-bonding position of said electrodes and leads;

f. bonding said leads to said electrodes;

g. detecting the relative post-bonding position of said electrodes and leads; and

h. determining the difference between said pre-bonding and post-bonding positions to form a new position correction value for use in step d in the next succeeding bonding cycle.

2. A method of successive bonding cycles each comprising the bonding of semiconductor elements to leads provided on a carrier film by obtaining an updated value based upon the difference between a previously determined updated value and a position correction value determined from the difference between recognized pre-bonding and post-bonding positions established during a bonding cycle and comprising:

a. providing a semiconductor element having electrodes;

b. providing a carrier film having one or more leads and a location for receiving said semiconductor element;

c. positioning said electrodes and leads for bonding based upon a previously updated value which in the case of the first bonding cycle is assigned a value of zero;

d. correcting the relative positioning of said electrodes and leads in step c based on a previously determined position correction value;

e. detecting a value based upon the relative positions of the electrodes and leads following step d except in the case of the first bonding cycle wherein the value is assigned zero;

f. bonding said leads to said electrodes;

g. detecting a value based upon the relative positions of said electrodes and leads following step f;

h. determining the difference between the values of the relative positions of steps e and g to form a new position correction value; and

i. determining a new updated value based upon the difference between the value determined in step d and the value determined in step h.