Resonant tag and method of manufacturing the same
First Claim
1. A resonant tag comprising:
- a single insulating thin film;
a conductive capacitor element pattern and a conductive inductor element pattern formed on one surface of said insulating thin film, said conductive capacitor element pattern corresponding to a resonant frequency and said conductive inductor element pattern being located circumferentially around the conductive capacitor element pattern; and
a conductive capacitor element pattern formed on the other surface of said insulating thin film at a position which faces said conductive capacitor element pattern formed on said one surface, said conductive capacitor element pattern corresponding to said resonant frequency,wherein at least a portion of said insulating thin film on which said two conductive capacitor element patterns are formed is reduced in thickness to space said capacitor elements to enable deactivation of the tag by placement in an electromagnetic field and also to space said capacitor elements to produce said resonant frequency, and wherein said conductive capacitor and inducator patterns form LC resonant circuit having an inherent resonant frequency.
3 Assignments
0 Petitions
Accused Products
Abstract
A resonant tag is manufactured in the manner described below: a conductive thin film is formed to a predetermined thickness on two surfaces of an insulating thin film. Thereafter, a conductive pattern, composed of an inductor element and a capacitor element corresponding to a resonant frequency of a resonant circuit, is printed on a surface of one of the conductive thin films, and a conductive pattern, composed of a capacitor element corresponding to the resonant frequency of the resonant circuit, is printed on a surface of the other insulating thin film at a position which faces the capacitor element formed on one of the conductive thin films using an ink which resists etching. A non-printed portion of the conductive thin films is removed by etching to form a resonant circuit pattern. Thereafter, a portion of the insulating thin film, which corresonds to the capacitor element pattern, is thinned to a desired thickness by pressing a heating/pressing member heated to a predetermined temperature against that portion under a predetermined pressure for a predetermined period of time.
72 Citations
6 Claims
-
1. A resonant tag comprising:
-
a single insulating thin film; a conductive capacitor element pattern and a conductive inductor element pattern formed on one surface of said insulating thin film, said conductive capacitor element pattern corresponding to a resonant frequency and said conductive inductor element pattern being located circumferentially around the conductive capacitor element pattern; and a conductive capacitor element pattern formed on the other surface of said insulating thin film at a position which faces said conductive capacitor element pattern formed on said one surface, said conductive capacitor element pattern corresponding to said resonant frequency, wherein at least a portion of said insulating thin film on which said two conductive capacitor element patterns are formed is reduced in thickness to space said capacitor elements to enable deactivation of the tag by placement in an electromagnetic field and also to space said capacitor elements to produce said resonant frequency, and wherein said conductive capacitor and inducator patterns form LC resonant circuit having an inherent resonant frequency. - View Dependent Claims (2, 6)
-
-
3. A method of manufacturing a resonant tag comprising the steps of:
-
forming a conductive thin film on two surfaces of an insulating thin film; printing, on a surface of one of said conductive thin films, a first conductive pattern composed of an inductor element and a capacitor element corresponding to a resonant frequency of a resonant circuit using an ink which resists etching, as well as a second conductive pattern composed of a capacitor element corresponding to said resonant frequency of said resonant circuit on a surface of the other insulating thin film at a position which faces said capacitor element formed on said one conductive thin film using said ink which resists etching; removing non-printed portion of said conductive thin films by etching; thinning at least a portion of said insulating thin film corresponding to said capacitor element pattern in a resonant circuit pattern formed by said etching process to a desired thickness; and forming a LC resonant circuit in said desired resonant circuit pattern by electrically connecting, via a throughole, in said film said first conductive and second conductive patterns. - View Dependent Claims (4, 5)
-
Specification