Method of cleaving a brittle plate and device for carrying out the method

  • US 5,132,505 A
  • Filed: 03/04/1991
  • Issued: 07/21/1992
  • Est. Priority Date: 03/21/1990
  • Status: Expired due to Fees
First Claim
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1. A method of cleaving a brittle plate in which a radiation beam originating from a source of radiation is passed over a desired track of the plate, which beam produces thermomechanical stresses in the plate and causes, starting from a crack initiation, a crack to be formed along a desired line of rupture, characterized in that the radiation beam is passed repeatedly over the track until the plate has been cleaved along the desired line of rupture, and characterized in that a first radiation beam is passed repeatedly over a first desired track of a first glass plate belonging to a number of liquid crystal display devices and a second radiation beam is passed repeatedly over a second desired track of a second glass plate belonging to the liquid crystal display devices until the plates have been cleaved along a first and a second desired line of rupture, respectively, which are located between two adjacent liquid crystal display devices.

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