Chip carrier for a microwave semiconductor component

• US 5,155,575 A
• Filed: 01/23/1991
• Issued: 10/13/1992
• Est. Priority Date: 01/31/1990
• Status: Expired due to Term

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Zimmermann, Walter
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Nguyen, Viet Q.
• Application Number:
  US07/644,635
• Time in Patent Office: 629 Days
• Field of Search: 357/68, 357/70, 357/72, 357/81, 357/74, 357/23.14
• US Class Current: 257/666
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13064 : High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A chip carrier for a microwave semiconductor component with four external electrical contacts has a favorable operating and application behavior, even when a plastic housing is used. Two external source terminals are connected with each other as one pieve via a cross member. The cross member basically proceeds obliquely to a transverse axis or to a longitudinal axis of the chip carrier.

Claims

1. A semiconductor component assembly, comprising:

a semiconductor chip having at least first and second source contacts, a gate contact, and a drain contact;

a chip carrier assembly having the semiconductor chip located at a contacting region thereof, a first external source terminal, a second external source terminal, an external gate terminal, and an external drain terminal extending into the contacting region, and a protective sealing surrounding the contacting region and portions of the first and second source terminals, gate terminal, and drain terminal in the contacting region;

respective contact means connecting the first and second source contacts and gate and drain contacts of the semiconductor chip to the respective first and second external source terminals, external gate terminal, and external drain terminal;

the first source terminal and gate terminal extending outwardly from the contacting region at a first side thereof and a drain terminal and second source terminal extending outwardly from the contacting region at an opposite second side thereof;

the first source terminal and the drain terminal lying at a first side of a geometric line and the gate terminal and the second source terminal lysing at an opposite side of said geometric line;

the first external source terminal and second external source terminal being connected via a web-like cross member passing through the contacting region and wherein said semiconductor chip is fastened on the cross member; and

the cross member and opposite side edges thereof proceeding substantially obliquely to said geometric line.

2. An assembly according to claim 1 wherein the protective sealing is substantially rectangular, and said geometric line being transverse to first and second opposite sides of the protective sealing.

3. An assembly according to claim 1 wherein the protective sealing comprises plastic and the semiconductor chip is a microwave component.

4. An assembly according to claim 1 wherein the protective sealing comprises a rectangular housing having first and second opposite sides, said first source terminal and said first gate terminal extending outwardly from said first side and said drain terminal and said second source terminal extending outwardly from said opposite second side, and wherein said geometric line is transverse to said first and second opposite sides of said protective sealing.

5. A chip carrier assembly for a microwave semiconductor chip, comprising:

at least four external electrical contacts comprising first and second external source terminals, an external gate terminal, and an external drain terminal;

the first source terminal and the gate terminal being arranged on a first side of the chip carrier, and the second source terminal and the drain terminal being arranged on an opposite second side of the chip carrier;

in a plan view of the chip carrier the terminals being arranged such that a geometric line can be arranged between the first external source terminal and gate terminal at the first side of the chip carrier and such that said geometric line also proceeds between the second source terminal and the drain terminal at the second opposite side of the chip carrier, the first source terminal and the second source terminal being located on different sides of said geometric line;

the first source terminal being connected with the second source terminal as one piece via a cross member, and a region being provided on said cross member at which a semiconductor chip can be fastened; and

said cross member and substantially parallel and opposite side edges thereof proceeding substantially obliquely to said geometric line, and wherein said gate terminal has a border which is also oblique to said geometric line and substantially parallel to the cross member side edge which is directly adjacent to said border.

6. A chip carrier assembly according to claim 5 wherein two of the external contacts are arranged at each of first and second opposite longitudinal sides of the chip carrier, and wherein said geometric line proceeds transversely relative to an axis of the chip carrier between these first and second sides.

7. A chip carrier assembly according to claim 5 wherein a center line extending longitudinally along the cross member cuts said geometric line in oblique fashion.

8. A chip carrier assembly according to claim 5 wherein said cross member extends longitudinally substantially at an angle of 45°

to said geometric line.

9. A chip carrier assembly according to claim 5 wherein said region for fastening the semiconductor chip defines a space which is rectangular in shape and wherein sides of the rectangle are oblique to said geometric line.

10. A chip carrier assembly according to claim 5 wherein the drain and gate terminals have electrode portions directly adjacent to sides of the cross member.

11. A chip carrier assembly according to claim 10 wherein a border of the drain electrode portion directly adjacent and closest to the cross member proceed obliquely to said geometric line.

12. A chip carrier assembly according to claim 10 wherein said oblique border of the gate electrode portion is directly adjacent and closest to the cross member.

13. A chip carrier assembly according to claim 10 wherein the chip carrier assembly has a protective sealing and wherein at least one of said gate and drain electrode portions has means for stable anchoring to the protective sealing.

14. A chip carrier assembly according to claim 10 wherein the semiconductor chip is connected via two bonding wires with the gate electrode portion.

15. A chip carrier assembly according to claim 10 wherein the semiconductor chip is connected via two bonding wires with the drain electrode portion.

16. A chip carrier assembly according to claim 10 wherein the gate electrode portion is contacted in double fashion.

17. A chip carrier assembly according to claim 10 wherein the source electrode portion is contacted in four-fold fashion.

18. A chip carrier assembly according to claim 10 wherein the drain electrode portion is contacted in double fashion.

19. A chip carrier assembly according to claim 5 wherein the semiconductor chip is connected with the cross member via four bonding wires.

20. A chip carrier assembly according to claim 5 wherein the semiconductor chip has a rectangular shape and wherein sides of the rectangle are arranged obliquely to the geometric line.

21. A microwave semiconductor component assembly, comprising:

a semiconductor chip having at least first and second source contacts, a gate contact, and a drain contact;

a chip carrier assembly having the semiconductor chip located at a contacting region thereof, a first external source terminal, a second external source terminal, an external gate terminal, and an external drain terminal extending into the contacting region, and a protective sealing surrounding the contacting region and portions of the first and second source terminals, gate terminal, and drain terminal in the contacting region;

respective contact means connecting the first and second source contacts and gate and drain contacts of the semiconductor chip to the respective first and second external source terminals, external gate terminal, and external drain terminals,

the first source terminal and gate terminal extending outwardly from the contacting region at a first side thereof and a drain terminal and second source terminal extending outwardly from the contacting region at an opposite second side thereof;

the first source terminal and the drain terminal lying at a first side of a geometric line and the gate terminal and the second source terminal lysing at an opposite side of said geometric line;

the first external source terminal and second external source terminal being connected as one piece via a cross member passing through the contacting region and wherein said semiconductor chip is fastened on the cross member;

the cross member and opposite side edges thereof proceeding substantially obliquely to said geometric line; and

the oblique sides of the cross member and placements of the drain terminal and gate terminal at respective spacings which are relatively close to the respective oblique sides of the semiconductor chip being selected to permit operation of the assembly above 12 GHz.