Integrated filter and detector array for spectral imaging

• US 5,159,199 A
• Filed: 08/12/1991
• Issued: 10/27/1992
• Est. Priority Date: 08/12/1991
• Status: Expired due to Fees

• Current Assignee: The Government Of The United States Of America, As Represented By The Secretary Of The Navy
• Original Assignee: United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration
• Inventors: LaBaw, Clayton C.
• Primary Examiner(s): Hannaher, Constantine
• Application Number:
  US07/744,197
• Time in Patent Office: 442 Days
• Field of Search: 357/30 L, 359/859, 356/328, 250/339
• US Class Current: 250/339.02
• CPC Class Codes: G01J 2003/2806 Array and filter array
• CPC Class Codes: G01J 2003/2826 Multispectral imaging, e.g. filter imaging
• CPC Class Codes: G01J 3/02 Details
• CPC Class Codes: G01J 3/0256 Compact construction
• CPC Class Codes: G01J 3/26 using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
• CPC Class Codes: G01J 3/2803 using photoelectric array detector
• CPC Class Codes: G01J 3/2823 Imaging spectrometer
• CPC Class Codes: H01L 31/02162 for filtering or shielding light, e.g. multicolour filters for photodetectors
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

A spectral imaging system having an integrated filter and photodetector array. The filter has narrow transmission bands which vary in frequency along the photodetector array. The frequency variation of the transmission bands is matched to, and aligned with, the frequency variation of a received spectral image. The filter is deposited directly on the photodetector array by a low temperature deposition process. By depositing the filter directly on the photodetector array, permanent alignment is achieved for all temperatures, spectral crosstalk is substantially eliminated, and a high signal-to-noise ratio is achieved.

Claims

1. A spectral imaging system for detecting the optical spectrum of a target, the system comprising:

means for receiving an optical signal from the target;

dispersion means for dispersing the optical signal into a spectral signal with component spectra of the optical signal provided along a spectral axis having a frequency range;

detector means aligned with the spectral axis of the spectral signal for receiving and detecting the spectral signal;

the detector means including an optical filter for substantially eliminating stray and background optical signals from detection by the detector means, the optical filter comprising a plurality of bands, the transmission frequency of the bands varying along the detector means, the optical filter being aligned with the spectral axis of the spectral signal, the transmission frequencies of the bands being matched to and aligned with component frequencies of the spectral image; and

the optical filter being directly deposited on the detector means such that the optical filter remains in alignment with the detector means despite temperature changes, shock or vibration.

2. The spectral imaging system of claim 1, wherein the dispersion means is a diffraction grating.

3. The spectral imaging system of claim 1, wherein the detector means comprises a photoarray of discrete photodetectors.

4. The spectral imaging system of claim 3, wherein the photodetector array is a silicon photodetector array.

5. The spectral imaging system of claim 4, wherein the photodetector array is formed from direct microlithography of a photosensitive material.

6. The spectral imaging system of claim 5, wherein the photosensitive material is InSb.

7. The spectral imaging system of claim 5, wherein the photosensitive material is HgCdTe.

8. The spectral imaging system of claim 3, wherein the photodetector array is a gallium arsenide photodetector array.

9. The spectral imaging system of claim 3, wherein the photodetector array is a spot diffusion doped extrinsic semiconductor photodetector array.

10. The spectral imaging system of claim 9 wherein the photodetector array is comprised of silicon doped with arsenic.

11. The spectral imaging system of claim 9, wherein the photodetector array comprises silicon doped with bromine.

12. The spectral imaging system of claim 3, wherein said photodetector array comprises:

a charge coupled device multiplexer formed on a semiconductor substrate;

a plurality of closely spaced soft metal beads formed on a surface of the multiplexer; and

a doped photosite array mounted onto the substrate over the soft metal beads.

13. The spectral imaging system of claim 12, wherein the soft metal beads are indium beads.

14. The spectral imaging system of claim 13, wherein the multiplexer is comprised of aluminum gallium arsenide.

15. The spectral imaging system of claim 12, wherein the multiplexer is comprised of polysilicon.

16. The spectral imaging system of claim 1, wherein the optical filter is a multilayer filter.

17. The spectral imaging system of claim 1, wherein the optical filter is an interference filter.

18. The spectral imaging system of claim 1, wherein the optical filter is a thin film filter.

19. The spectral imaging system of claim 1, wherein the frequency range of the dispersion means comprises the infrared frequencies.

20. The spectral imaging system of claim 1, wherein the spectral imaging system further comprises:

a first Schwarzchild optical system for receiving the optical signal from the target and for focusing the optical signal onto a slit;

a second Schwarzchild optical system for receiving a portion of the optical signal through the slit and for collimating and reflecting the portion of the optical signal onto the dispersion means for producing the spectral signal; and

a third Schwarzchild optical system for receiving the spectral signal from the dispersion means and for focusing the spectral signal onto the detector means.

21. A spectral imaging system for detecting the optical spectrum of a target, the system comprising:

means for receiving an optical signal from the target;

dispersion means for dispersing the optical signal into a spectral signal with component spectra of the optical signal provided along a spectral axis having a frequency range;

a photodetector array aligned with the spectral axis of the spectral signal for receiving and detecting the spectral signal, the photodetecter array including;

a charge coupled device multiplexer formed on a semiconductor substrate;

a plurality of closely spaced soft metal beads formed on a surface of the multiplexer; and

a doped photosite array mounted onto the substrate and electrically connected to the charge coupled device multiplexer by the soft metal beads;

an optical filter for substantially eliminating stray and background optical signals from detection by the photodetector array, the optical filter comprising a plurality of bands, the transmission frequency of the bands varying along the photodetector array, the optical filter being aligned with the spectral axis of the spectral signal, the transmission frequencies of the bands being matched to, and aligned with component frequencies of the spectral image; and

the optical filter being directly deposited on the photosite array such that the optical filter remains in alignment with the photodetector array despite temperature changes, shock or vibration.

22. A spectral imaging system for detecting the optical spectrum of a target, the system comprising:

means for receiving an optical signal from the target;

dispersion means for dispersing the optical signal into a spectral signal with component spectra of the optical signal provided along a spectral axis having a frequency range;

a photodetector array aligned with the spectral axis of the spectral signal for receiving and detecting the spectral signal, the photodetector array including;

a doped photosite array mounted onto a semiconductor substrate and comprising a 20×

64 array of photosite pixels, each photosite element comprising arsenic doped silicon;

a PMOS charge coupled device multiplexer formed on the semiconductor substrate beneath said photosite array and having a plurality of charge collector sites arranged to correspond one for one with said photosite pixels;

a plurality of closely spaced indium beads formed on a surface of the multiplexer, one bead electrically connecting each corresponding pixel and photosite; and

an optical filter for substantially eliminating stray and background optical signals from detection by the photodetector array, the optical filter comprising a plurality of 100 micrometer (μ

m) wide bands, each transmitting a 250 nanometer wide spectral band, the transmission frequency of the bands varying along the photodetector array from 7.5 μ

m to 14 μ

m, the optical filter being aligned with the spectral axis of the spectral signal, the transmission frequencies of the bands being matched to, and aligned with component frequencies of the spectral image; and

the optical filter being directly deposited on the photosite array such that the optical filter remains in alignment with the photodetector array despite temperature changes, shock or vibration.