Leadless semiconductor device and method for making the same

  • US 5,172,214 A
  • Filed: 04/10/1992
  • Issued: 12/15/1992
  • Est. Priority Date: 02/06/1991
  • Status: Expired due to Term
First Claim
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1. A leadless semiconductor device comprising:

  • a leadframe having a die receiving area and a plurality of leads extending outwardly from positions adjacent the die receiving area, each of the leads having first and second portions and an intermediate portion, the first portion of each lead being closer to the die receiving area than the second portion, and each of the first and second portions being separated by the intermediate portion thereof;

    a semiconductor die positioned at the die receiving area of the leadframe and electrically coupled to the plurality of leads; and

    a package body having a top surface, a bottom surface, and a perimeter, wherein the semiconductor die, the plurality of leads, and the die receiving area are completely contained within the package body and wherein a first surface of each of the second portions of the leads and an entire surface of the die receiving area are exposed on and substantially flush with one of either the top surface or bottom surface of the package body.

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