Dark field imaging defect inspection system for repetitive pattern integrated circuits

• US 5,177,559 A
• Filed: 05/17/1991
• Issued: 01/05/1993
• Est. Priority Date: 05/17/1991
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Taubenblatt, Marc A., Batchelder, John S.
• Primary Examiner(s): Rosenberger, Richard A.
• Application Number:
  US07/701,936
• Time in Patent Office: 599 Days
• Field of Search: 356/338, 356/237
• US Class Current: 356/237.5
• CPC Class Codes: G01N 2021/8822 Dark field detection
• CPC Class Codes: G01N 21/95623 using a spatial filtering method per se G02B
• CPC Class Codes: G02B 21/10 affording dark-field illumination G02B21/14 and G02B21/125 take precedence

Abstract

An optical inspection system for patterned semiconductor wafers generates a dark field image of the wafer by applying a collimated beam of monochrome light at an incident angle with respect to the surface of the wafer of between 8° and a maximum angle defined by the numerical aperture of the imaging system and collecting the light which is scattered at angles approximately normal to the surface of the wafer and within the numerical aperture of the imaging system. In addition, the incident light is at an angle of 45° in the surface plane of the wafer with respect to the rectangular lines which predominate in the pattern. Before forming the dark field image, the collected light is passed through a Fourier transform filter which substantially attenuates spatial frequency components corresponding to the pattern. In the resultant dark field image, defects in the pattern and contaminating particles are accentuated relative to the pattern features.

Claims

1. A method of locating defects on a surface having a repetitive pattern comprising the steps of:

a) illuminating the surface with a beam of monochrome light at an angle with respect to the surface of the wafer of between 8 degrees and a predetermined maximum angle;

b) capturing any light which is scattered from the surface at angles greater than the predetermined maximum angle;

c) spatially filtering the captured light to attenuate spatial frequencies corresponding to the repetitive pattern relative to spatial frequencies corresponding to the defects;

d) focusing the spatially filtered light into an image, wherein images of the defects are accentuated relative to the image of the repetitive pattern.

2. The method of claim 1 wherein the step a) includes the step of collimating the beam of monochrome light.

3. The method of claim 1 wherein the step a) includes the step of polarizing the beam of monochrome light.

4. The method of claim 1 wherein the surface is planar and the repetitive pattern includes predominantly rectangular features, said step a including the step of orienting the incident beam with respect to the surface at an oblique angle to the rectangular features in the plane of the surface.

5. The method of claim 1 wherein:

the step c) includes the steps of;

generating the Fourier transform of the captured light; and

filtering the Fourier transformed light to attenuate at least one spatial frequency component of the repetitive image; and

the step d) includes the steps of;

generating an inverse Fourier transform of the spatially filtered light to produce said image.

6. Apparatus which may be used to locate defects on a surface having a repetitive pattern comprising:

a) illuminating means for illuminating the surface with at least one beam of monochrome light at a desired angle with respect to the surface of the wafer of between 8 degrees and a predetermined maximum angle;

b) lens means positioned with an optical axis normal to the surface for capturing light which is scattered from the surface at angles within the numerical aperture of the lens means, wherein the numerical aperture of the lens means defines said predetermined maximum angle;

c) filtering means for spatially filtering the captured light to attenuate spatial frequencies corresponding to the repetitive pattern relative to spatial frequencies corresponding to the defects; and

d) imaging means for focusing the spatially filtered light into an image, wherein images of the defects are accentuated relative to the image of the repetitive pattern.

7. The apparatus of claim 6 wherein:

the illuminating means includes;

means for generating a beam of monochrome light;

means for collimating the beam provided by the generating means; and

means for directing the collimated beam at the surface at the desired angle.

8. The apparatus of claim 7 wherein the illuminating means further includes means for polarizing said collimated beam.

9. The apparatus of claim 6 wherein the filtering means includes:

Fourier transform means for forming an image representing an optical Fourier transform of the captured light; and

Fourier filtering means for attenuating portions of said Fourier transform representation corresponding to spatial frequencies exhibited by portions of said captured light corresponding to said repeated pattern relative to other portions of said Fourier transform representation to provide a filtered Fourier Transform representation.

10. The apparatus of claim 9 wherein said Fourier transform means includes a Fourier transform lens.

11. The apparatus of claim 9 wherein said Fourier transform filtering means includes a 1:

1 lens positioned at a distance of two focal lengths from said surface to produce said optical Fourier transform representation of said captured light at a distance of one focal length from said 1;

1 lens.

12. The apparatus of claim 9 wherein said Fourier transform means includes a microscope objective lens and a relay lens.

13. An apparatus in accordance with claim 12 in which the imaging means includes a tube lens for achieving a desired optical tube length.

14. A method of locating defects on a surface having a repetitive pattern comprising the steps of:

a) illuminating the surface with a beam of monochrome light at an angle of between 8 and 45 degrees with respect to the surface;

b) capturing any light which is scattered from the surface at angles between 45 degrees and 90 degrees;

c) spatially filtering the captured light to attenuate spatial frequencies corresponding to the repetitive pattern relative to spatial frequencies corresponding to the defects;

d) focusing the spatially filtered light into an image, wherein components of the image representing the defects on the surface are accentuated relative to components of the image representing the repetitive pattern.

15. A method in accordance with claim 14, in which step (a) includes the step of illuminating the surface with a beam of monochrome light at an angle of between 20 and 45 degrees with respect to the surface to accentuate light captured from defects located at and below said surface.

16. A method in accordance with claim 14, in which step (a) includes the step of polarizing the beam of monochrome light to form a p polarized beam, to suppress imaging of trench features below the surface while detecting defects at and below the surface.