Thermal switch

• US 5,181,005 A
• Filed: 10/22/1991
• Issued: 01/19/1993
• Est. Priority Date: 10/25/1990
• Status: Expired due to Fees

• Current Assignee: Electrovac Fabrikation Elektrotechnischer Spezialartikel GmbH
• Original Assignee: Electrovac Fabrikation Elektrotechnischer
• Inventors: Bayer, Helmut
• Primary Examiner(s): Broome, Harold
• Application Number:
  US07/780,231
• Time in Patent Office: 455 Days
• Field of Search: 337/365, 337/354, 337/348, 337/342, 236/48 R
• US Class Current: 337/354
• CPC Class Codes: H01H 37/54 wherein the bimetallic element is inherently snap acting
• CPC Class Codes: H01H 37/64 Contacts
• CPC Class Codes: H01H 37/74 Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling

Abstract

Thermal switch having a thermal bimetallic snap-over disc temperature sensor which interacts via a transmission component with a contact system which has at least one contact carrier carrying or forming a movable contact, the movable contact resting against at least one fixed contact in the quiescent state. In order to ensure that the switch remains in the non-quiescent open position after the thermal sensor has been tripped, provision is made that the movable contact is formed by a wire-type or strip-type contact part which can be plastically deformed by the transmission component actuated by the thermal bimetallic snap-over disc temperature sensor.

Claims

1. A thermal switch comprising:

a thermal bimetallic snap-over disc temperature sensor;

a contact system including a fixed contact assembly and a movable contact assembly, said movable contact assembly including a plastically deformable portion, said movable contact assembly contacting said fixed contact assembly in a quiescent state; and

a transmission component, directly contacting said disc and said plastically deformable portion, said transmission component plastically deforming said plastically deformable portion when actuated by said disc, said plastic deformation of said plastically deformable portion breaking contact between said fixed contact assembly and said movable contact assembly.

2. A thermal switch according to claim 1 wherein:

said plastically deformable portion is in contact in a spring manner with said fixed contact assembly in the quiescent state.

3. A thermal switch according to claim 1 or 2 wherein:

said plastically deformable portion is constructed with at least one weak point.

4. A thermal switch according to claim 1 or 2 further comprising:

a spring which presses said plastically deformable portion against said fixed contact assembly in said quiescent state.

5. A thermal switch according to claim 4 wherein:

said plastically deformable portion is constructed with at least one weal point.

6. A thermal switch according to claim 4 wherein:

said spring is constructed with at least one weak point.

7. A thermal switch according to claim 4 wherein:

said spring is constructed with at least one weak point; and

said plastically deformable portion is constructed with at least one weak point.

8. A thermal switch according to claim 4 wherein:

said spring is constructed with at least one weak point;

said plastically deformable portion is constructed with at least one weak point; and

said spring can be plastically deformed when said transmission component is actuated by said disc.

9. A thermal switch according to claim 4 wherein:

said spring can be plastically deformed when said transmission component is actuated by said disc.

10. A thermal switch according to claim 9 wherein:

said plastically deformable portion is constructed with at least one weak point.

11. A thermal switch according to claim 9 wherein:

said spring is constructed with at least one weak point.