Plastic molded type electronic device

• US 5,181,097 A
• Filed: 11/13/1990
• Issued: 01/19/1993
• Est. Priority Date: 06/10/1988
• Status: Expired due to Fees

• Current Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Original Assignee: Hitachi, Ltd.
• Inventors: Abe, Hidetoshi, Horie, Osamu, Segawa, Masanori, Ogata, Masatsugu, Sugawara, Yasuhide
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Crane, Sara W.
• Application Number:
  US07/611,549
• Time in Patent Office: 798 Days
• Field of Search: 357/72, 357/74, 264/272.17, 428/413, 174/52.2
• US Class Current: 257/788
• CPC Class Codes: C08G 8/10 with phenol
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 61/04 Condensation polymers of aldehydes or ketones with phenols only
• CPC Class Codes: C08L 61/06 of aldehydes with phenols
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: H01B 3/36 condensation products of phenols with aldehydes or ketones
• CPC Class Codes: H01B 3/40 epoxy resins
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 428/31511 Of epoxy ether

Abstract

The phenol resin molding composition used in the present invention is obtained by subjecting a resol-type phenol resin to purification until, when the resin is extracted by heating with 10 times the amount of hot water at 120° C. for 100 hours or more, the extract has an electric conductivity of 100 μS/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less, then preparing a composition comprising a resin component consisting of said resol-type phenol resin and a cure rate controlling agent incorporated therewith, optionally incorporating a filler into said composition, kneading the resulting mixture, and then grinding the kneaded mixture. The composition has a good moldability and, when used for resin-sealing of electronic devices or semiconductor devices and transfer-molding of electronic devices using resin, exhibits an excellent adhesive property, electric properties, moisture resistance and heat resistance.

Claims

1. A plastic molded type electronic device, wherein the device is sealed with a phenolic resin molding composition comprising a resin component consisting of a resol-type phenol resin and at least one epoxy resin in a weight ratio of from 75:

25 to 95;

5, the resin component having been purified until it gives, when extracted by heating with 10 times the amount of hot water at 120°

C. for 100 hours or more, an extract having an electric conductivity of 100 μ

S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less.

2. The device of claim 1, wherein the phenolic resin molding composition further comprises 55-80% by volume of an inorganic filler relative to the total volume of the composition.

3. The device of claim 2, wherein the inorganic filler is at least one member selected from the group consisting of fused silica, crystalline silica, and alumina, each having an average particle diameter of

5. A plastic molded type electronic device according to claim 1, wherein said electronic device is a semiconductor device and includes an aluminum electrode and a gold wire joined to said aluminum electrode.

9. The device of claim 2 wherein said phenolic resin molding composition consists essentially of said resin component and said inorganic filler and wherein said phenolic resin molding composition has a flame resistance grade V - O.

4. A plastic molded type electronic device, wherein the device is transfer-molded with a phenolic resin molding composition comprising a resin component consisting of a resol-type phenol resin and a modifier in a weight ratio of from 75:

25 to 95;

5, the resin component having been purified until it gives, when extracted by heating with 10 times the amount of hot water at 120°

C. for 100 hours or more, an extract having an electric conductivity of 100 μ

S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less.

6. The device of claim 4, wherein the phenolic resin molding composition further comprises 55-80% by volume of an inorganic filler relative to the total volume of the composition.

7. The device of claim 6, wherein the inorganic filler is at least one member selected from the group consisting of fused silica, crystalline silica, and alumina, each having an average particle diameter of 1-30 μ

m.

8. The device of claim 6, wherein said phenolic resin molding composition consists essentially of said resin component and said inorganic filler and wherein said phenolic resin molding composition has a flame resistance grade V - O.