Structurally-embedded electronics assembly

• US 5,184,141 A
• Filed: 04/05/1990
• Issued: 02/02/1993
• Est. Priority Date: 04/05/1990
• Status: Expired due to Term

• Current Assignee: VAC Acquisition Corp.
• Original Assignee: Vought Aircraft Company
• Inventors: Williams, Thomas W., Connolly, Jerome J., D'Agostino, William L., Thomas, Gerald F., Barrick, Michael D.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): BROWN, PETER T
• Application Number:
  US07/505,757
• Time in Patent Office: 1,034 Days
• Field of Search: 343/705, 343/711, 343/872, 343/873, 343/878, 343/785, 343/700 MS File, 343/713, 343/708, 343/786, 244/117 A, 244/117 R, 244/119, 244/121, 244/126
• US Class Current: 343/705
• CPC Class Codes: H01Q 1/005 Damping of vibrations; Means for reducing wind-induced forces
• CPC Class Codes: H01Q 1/286 substantially flush mounted with the skin of the craft
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome

Abstract

A structurally-embedded electronics assembly is disclosed and includes an outer skin member which is lightly loaded structurally, a primary load-carrying member positioned inboard from the outer skin member, a core member positioned between the primary load-carrying member and the outer skin member, an intermediate skin member positioned between the outer skin member and the core member and an electronics structure positioned between a predetermined two of the members or intermingled with a predetermined number of the members set forth above which are adjacent each other. In another embodiment, a thermally conductive baseplate member is positioned inboard from the primary load-carrying member. In another embodiment, a vibration damping member is positioned inboard from the primary load-carrying member.

Claims

1. A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

an outer skin member;

a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure of the vehicle;

a honeycomb core member positioned between said primary load-carrying member and said outer skin member;

an electronics structure positioned between said outer skin member and said honeycomb core member;

a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member; and

a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive baseplate member.

2. The structurally-embedded electronics assembly of claim 1 further including a layer of structural adhesive operatively positioned between said core member and said primary load-carrying member.

3. The structurally-embedded electronics assembly of claim 1 wherein said electronics structure comprises an antenna.

4. The structurally-embedded electronics assembly of claim 1 wherein said electronics structure comprises a sensor.

5. The structurally-embedded electronics assembly of claim 1 wherein said primary load-carrying member comprises carbon/epoxy.

6. The structurally-embedded electronics assembly of claim 1 wherein said primary load-carrying member comprises fiberglass/bismaleimide.

7. The structurally-embedded electronics assembly of claim 1 wherein said outer skin member comprises fiberglass/bismaleimide.

8. The structurally-embedded electronics assembly of claim 1 wherein said outer skin member comprises fiberglass/epoxy.

9. The structurally-embedded electronics assembly of claim 1 wherein said core member comprises a fiberglass reinforced polyimide core.

10. The structurally-embedded electronics assembly of claim 1 wherein said core member comprises a polyvinyl chloride closed cell foam core.

11. The structurally-embedded electronics assembly of claim 1 further including an intermediate skin member positioned between said electronics structure and said core member.

12. The structurally-embedded electronics assembly of claim 4 further including a layer of structural adhesive operatively positioned between said intermediate skin member and said core member.

13. The structurally-embedded electronics assembly of claim 11 wherein said intermediate skin member comprises fiberglass/bismaleimide.

14. The structurally-embedded electronics assembly of claim 11 wherein said intermediate skin member comprises silicon carbide/polyimide.

15. The structurally-embedded electronics assembly of claim 1 further including electronic modules operatively mounted to said thermally conductive baseplate member on the side thereof away from said primary load-carrying member.

16. The structurally-embedded electronics assembly of claim 15 further including an electromagnetic feed between said electronic modules and said electronics structure.

17. The structurally-embedded electronics assembly of claim 15 further including cooling means operatively positioned with respect to said electronics modules to provide cooling thereto.

18. The structurally-embedded electronics assembly of claim 15 further including a protective conformed coating covering said electronic modules.

19. The structurally-embedded electronics assembly adapted for integration with a structure, comprising:

an outer skin member;

a primary structural member positioned inboard from said outer skin member, said primary structural member being structured for attachment to the structure;

a core member positioned between said primary structural member and said outer skin member;

an antenna structure mounted between said outer skin member and said core member;

an intermediate skin member positioned between said antenna structure and said core member;

a thermally conductive baseplate member positioned on the side of the primary structural member which is away from said core member; and

a layer of acoustic damping adhesive operatively positioned between said primary structural member and said thermally conductive baseplate member.

20. A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

an outer skin member;

a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure;

a core member positioned between said primary load-carrying member and said outer skin member;

at least said core member including a predetermined pattern of material having predetermined electromagnetic properties to form a horn antenna to confine and direct electromagnetic energy toward said outer skin member, an antenna feed connected to said horn antenna to introduce said electromagnetic energy into said horn antenna;

a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member; and

a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive baseplate member.

21. A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

an outer skin member;

a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure;

a core member positioned between said primary load-carrying member and said outer skin member;

a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member;

a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive base plate member; and

an electronic structure positioned between said outer skin member and said core member.

22. A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

an outer skin member;

a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure;

a core member positioned between said primary load-carrying member and said outer skin member;

an intermediate skin member positioned between said outer skin member and said core member;

an electronics structure positioned between said intermediate skin member and said core member;

a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member; and

a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive baseplate member.

23. A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

an outer skin member;

a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure;

a core member positioned between said primary load-carrying member an said outer skin member;

an electronics structure positioned within and enclosed by said core member;

a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member; and

a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive baseplate member.