Method of mounting silicon wafers on metallic mounting surfaces

• US 5,215,244 A
• Filed: 02/24/1992
• Issued: 06/01/1993
• Est. Priority Date: 03/09/1991
• Status: Expired due to Fees

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Klucken, Wolfgang, Trah, Hans-Peter, Buchholz, Juergen
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US07/840,327
• Time in Patent Office: 463 Days
• Field of Search: 228/121-124, 228/175, 228/189, 228/263.12
• US Class Current: 228/123.1
• CPC Class Codes: F02M 61/166 Selection of particular materials
• CPC Class Codes: F02M 61/168 Assembling; Disassembling; Manufacturing; Adjusting
• CPC Class Codes: F02M 61/1853 Orifice plates
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/0096 Fuel injection devices
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 24/26 Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01026 Iron [Fe]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/0133 : Ternary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER

Abstract

A method of mounting a semiconductor wafer (10) on a metallic mounting surface, particularly during manufacture of valves with macromechanical valve bodies (20), features the steps of applying a metallization (11) to at least one major surface of the semiconductor wafer, and thereafter soldering the thus-metallized major surface, either wholly or in localized surface areas, to the metallic mounting surface.

Claims

1. Method of mounting a semiconductor wafer (10) on a metallic mounting surface of a valve body (20),

comprising the steps of

applying a metallization (11) to at least one major surface of said semiconductor wafer (10);

and

soldering the thus-metallized major surface directly to said metallic mounting surface of said valve body (20).

2. Method according to claim 1,

wherein said applying step comprises applying a metal selected from the group consisting of chromium, nickel and gold.

3. Method according to claim 1, further comprising

prior to said soldering step,

applying a positioning aid (17, 27) to said metallic mounting surface, and

using said positioning aid to align an aperture formed in said silicon wafer with respect to an aperture formed in said metallic mounting surface of said body.

4. Method of mounting a semiconductor wafer (10) on a metallic mounting surface of a valve body (20),

comprising the steps of

applying a metallization (11) to at least one major surface of said semiconductor wafer (10);

soldering the thus-metallized major surface to a mounting surface of an intermediate element (25'"'"'); and

securing said intermediate element (25'"'"') to said valve body (20).

5. Method according to claim 4, wherein said intermediate element (25'"'"') is secured by laser welding to said valve body.

6. Method according to claim 4, wherein said intermediate element (25) is generally planar and forms a layer intermediate said valve body (20) and said wafer (10).

7. Method according to claim 4, wherein

said intermediate element (25'"'"') has first and second major surfaces, and is both soldered to said wafer (10) by said first major surface and secured to said valve body (20) by said first major surface, thereby securing said wafer (10) in position between said element (25'"'"') and said valve body (20) without directly connecting said wafer to said valve body.

8. Method according to claim 5, wherein said applying step comprises applying a metal selected from the group consisting of chromium, nickel and gold.