Copper clad epoxy printed circuit board suitable for microwave frequencies encountered in GPS receivers
First Claim
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1. A method for fabricating a multilayer printed circuit board (PCB) package, the method comprising the steps of:
- bonding double-treated copper foil to a substrate of an alloy of epoxy and polyphenylene oxide (PPO) resin to form a first laminate;
etching a circuit pattern in said double-treated copper foil; and
direct bonding under heat and pressure the double-treated copper foil side of said first laminate to a second laminate comprised of an alloy of epoxy and polyphenylene oxide (PPO) resin.
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Abstract
A method for making printed circuit boards comprises using double treated copper foils for all inside conductor layers of multilayer packages with substrates of alloys of epoxy and polyphenylene oxide (PPO) resin to counteract the skin-effect encountered at high frequencies. Direct bonds between inside surfaces are then used without using an oxide step that introduces red/brown or black oxides.
45 Citations
4 Claims
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1. A method for fabricating a multilayer printed circuit board (PCB) package, the method comprising the steps of:
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bonding double-treated copper foil to a substrate of an alloy of epoxy and polyphenylene oxide (PPO) resin to form a first laminate; etching a circuit pattern in said double-treated copper foil; and direct bonding under heat and pressure the double-treated copper foil side of said first laminate to a second laminate comprised of an alloy of epoxy and polyphenylene oxide (PPO) resin. - View Dependent Claims (2, 3, 4)
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Specification