Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates

• US 5,283,104 A
• Filed: 03/20/1991
• Issued: 02/01/1994
• Est. Priority Date: 03/20/1991
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Giess, Edward A., Muller-Landau, Friedel, Vallabhaneni, Rao, Aoude, Farid Y., Van Hise, Jon A., Brownlow, deceased, James M., Neisser, Mark O., Kim, Young-Ho, Shaw, Thomas M., Cooper, Emanuel I., Park, Jae M., Knickerbocker, Sarah H., Walker, George F., Rita, Robert A., Farooq, Shaji, Duncombe, Peter R., Kim, Jungihl, Shaw, Robert R.
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US07/672,272
• Time in Patent Office: 1,049 Days
• Field of Search: 428/624, 428/632, 428/631, 428/612, 428/402, 428/137, 428/403, 428/209, 428/323, 428/324, 428/325, 428/195
• US Class Current: 428/195.1
• CPC Class Codes: H01B 1/16 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/4867 Applying pastes or inks, e.g. screen printing H01L21/486 takes precedence
• CPC Class Codes: H01L 23/49883 the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 428/12472 Microscopic interfacial wave or roughness
• CPC Class Codes: Y10T 428/12556 Organic component
• CPC Class Codes: Y10T 428/12604 Film [e.g., glaze, etc.]
• CPC Class Codes: Y10T 428/12611 Oxide-containing component
• CPC Class Codes: Y10T 428/24322 Composite web or sheet
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/25 : Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/251 : Mica
• CPC Class Codes: Y10T 428/252 : Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
• CPC Class Codes: Y10T 428/2982 : Particulate matter [e.g., sphere, flake, etc.]
• CPC Class Codes: Y10T 428/2991 : Coated

Abstract

Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 μm, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Claims

1. A circuitized ceramic structure comprising at least one layer of dielectric ceramic composition and at least one via, said at least one via being filled with a conductive via body comprising an electrically conductive skeletal network of a metal contained within a ceramic matrix, said conductive via body being a solid, non-porous mass represented by a major amount by volume of cosintered packed spheres of ceramic material having the spaces therebetween filled with a minor amount by volume of particles of said metal which are smaller in size than said spheres, to form a conductive path, the ceramic composition of said at least one dielectric layer being cosinterable with said ceramic matrix of each said via body, whereby the ceramic matrix is cosintered with and integrated with the at least one dielectric layer in the area of said via to form a hermetic seal between said solid via body and said at least one dielectric layer.

2. A structure according to claim 1 in which the ceramic composition of said at least one dielectric layer and the ceramic matrix of each said via body each comprises a glass containing a crystalline phase.

3. A structure according to claim 1 in which each said via body comprises a cosintered body of spheres of glass-ceramic composition having a substantially uniform sphere diameter which is less than about 10% of the diameter of said via, and in which, said sphere diameter is within the range of from about 0.5μ

m to about 6μ

m, and particles of said metal having a maximum dimension less than about one-third to about one-fourth the uniform diameter of said glass-ceramic spheres.

4. A structure according to claim 3 in which said metal particles comprise spheres.

5. A structure according to claim 1 in which said metal comprises copper.

6. A structure according to claim 1 in which said metal comprises a beryllium-containing alloy of copper having greater than 0% and up to 2% by weight beryllium.

7. A structure according to claim 1 in which said metal comprises a mixture of copper and an iron-cobalt alloy, said alloy having a TCE about the same as the ICE of said ceramic material.

8. A structure accorder to claim 7 in which said iron-cobalt alloy is selected from the group consisting of 31wt % nickel, 4 to 6wt % cobalt, balance iron;

36-37wt % iron, 53-55wt % cobalt and 9-10wt % chromium; and

37wt % iron, 30wt % nickel, 25wt % cobalt, 8wt % chromium.

9. A multilayer circuitized ceramic structure comprising at least two insulating layers of dielectric ceramic composition having insulated therebetween a thin electrically-conductive body, said structure having one or more vertical via holes formed through at least one insulating layer present at a surface of said structure and communicating with said electrically-conductive body, characterized by said via hole being filled with a conductive via body comprising an electrically-conductive skeletal network of a minor amount by volume of a metal contained within a major amount by volume of a ceramic matrix, said conductive via body being a solid, non-porous mass represented by cosintered packed spheres of ceramic material having the spaces therebetween filled with particles of said metal which are smaller in size than said spheres, to form a conductive path between the surface of said via body present at a surface of said ceramic circuit structure and said thin electrically-conductive body otherwise insulated between said layers of dielectric ceramic composition, the ceramic composition of said dielectric layers being cosinterable with said ceramic matrix of each said via body, whereby the ceramic matrix is cosintered with and integrated with the dielectric layer in the area of said via hole to form a hermetic seal between said via body and said dielectric layer.

10. A structure according to claim 9 in which the ceramic composition of said dielectric layers and the ceramic matrix of each said via body each comprises glass containing a crystalline phase and having a stable thermal coefficient of expansion.

11. A structure according to claim 9 in which each said via body comprises a cosintered body of spheres of glass-ceramic composition having a substantially uniform sphere diameter which is less than about 10% of the diameter of said via holes, and in which, said sphere diameter is within the range of from about 0.5μ

m to about 6μ

m, and particles of said metal having a maximum dimension less than about one-third to about one-fourth the uniform diameter of said glass-ceramic spheres.

12. A structure according to claim 11 in which said metal particles comprise spheres.

13. A structure according to claim 9 in which said metal comprises copper.

14. A structure according to claim 9 in which said metal comprises a beryllium-containing alloy of copper having greater than 0% and up to 2% by weight beryllium.

15. A structure according to claim 9 in which said metal comprises mixture of copper and an iron- cobalt alloy, said alloy having a TCE about the same as the TCE of said ceramic material.

16. A structure according to claim 15 in which said iron-cobalt alloy is selected from the group consisting of 31wt % nickel, 4 to 6wt % cobalt, balance iron;

36-37wt % iron, 53-55wt % cobalt and 9-10wt % chromium; and

37wt % iron, 30wt % nickel, 25wt % cobalt, 8wt % chromium.

17. A cosinterable via-fill paste composition comprising a uniform mixture of (a) a major amount by volume of spheres of ceramic composition having a substantially- uniform average diameter between about 0.5 μ

m and 6 μ

m, (b) a minor amount by volume of particles of low-resistive metal having a maximum size between about 1/3 and 1/4 the diameter of said ceramic spheres, and (c) a minor amount of an organic binder material in a volatile vehicle, said mixture containing a sufficient volume of said ceramic spheres to form densely packed via fill in which each of said spheres is in surface contact with at least two other spheres and a sufficient volume of said smaller metal particles to fill substantially all of the void spaces surrounding said ceramic spheres, whereby when said uniform mixture of spheres and metal particles is cosintered, there results a solid, substantially non-porous conductive via body comprising a continuous skeletal network of said metal contained within a matrix of ceramic composition.

18. A composition according to claim 17 in which said ceramic composition comprises a glass containing a crystalline phase.

19. A composition according to claim 17 in which said metal particles comprise spheres.

20. A composition according to claim 17 in which said organic binder material comprises ethyl cellulose.

21. A composition according to claim 17 in which said metal comprises copper.

22. A composition according to claim 17 in which said metal comprises a beryllium-containing alloy of copper having greater than 0% and up to 2% by weight beryllium.

23. A composition according to claim 17 in which said metal comprises a mixture of copper and an iron-cobalt alloy, said alloy having a TCE about the same as the TCE of said ceramic material.

24. A composition according to claim 23 in which said iron-cobalt alloy is selected from the group consisting of 31wt % nickel, 4 to 6wt % cobalt, balance iron;

36-37wt % iron, 53-55wt % cobalt and 9-10wt % chromium; and

37wt % iron, 30wt % nickel, 25wt % cobalt, 8wt %.

25. A conducting composite having a thermal coefficient of expansion matched to the thermal coefficient of the expansion of a glass-ceramic layer, comprising a paste containing a mixture of a minor amount by volume of copper particles and a major amount by volume of glass-ceramic spheres having a thermal coefficient of expansion about the same as that of said glass-ceramic layer, said copper particles having a maximum dimension less than about one-third to about one-fourth the uniform diameter of said glass-ceramic spheres.

26. A via-fill composition according to claim 25, in which said copper particles consist essentially of an alloy of copper and a minor amount by weight of beryllium.

27. A via-fill composition according to claim 26 in which said alloy contains from 0% to 2% by weight of beryllium.

28. A via-fill composition according to claim 25 having a thermal coefficient of expansion matched to the thermal coefficient of expansion of glass-ceramic layers containing the via, comprising a mixture of copper and an iron-cobalt alloy.

29. A via fill composition according to claim 28 in which said iron-cobalt alloy has zero thermal coefficient of expansion and comprises 31wt % nickel, 4 to 6wt % cobalt, remainder iron.

30. A via-fill composition according to claim 28 in which said iron-cobalt alloy comprises 36-37wt % iron, 53-55wt % cobalt and 9-10wt % chromium.

31. A via-fill composition according to claim 28 in which said iron-cobalt alloy comprises 37wt % iron, 30wt % nickel, 25wt % cobalt and 8wt % chromium.