LED head having heat radiating mount

• US 5,291,039 A
• Filed: 09/29/1992
• Issued: 03/01/1994
• Est. Priority Date: 09/30/1991
• Status: Expired due to Fees

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Ogata, Hiromi, Hamada, Hideharu, Koshikawa, Seiji
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): TRAN, MINH LOAN
• Application Number:
  US07/953,114
• Time in Patent Office: 518 Days
• Field of Search: 257/81, 257/98, 257/99, 257/712, 257/731, 362/800, 362/368, 362/373, 313/500
• US Class Current: 257/99
• CPC Class Codes: B41J 2/451 Special optical means therefor, e.g. lenses, mirrors, focusing means
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

An LED head includes a circuit substrate on which a light emitting element and drive IC are mounted, a SELFOC lens for condensing the irradiating light from the light emitting element on the circuit substrate, and a head cover of aluminum for holding the SELFOC lens spaced a given distance away from the light emitting element and for radiating heat from the circuit substrate.

Claims

1. An LED head comprising:

(a) a circuit substrate on which a light emitting element and drive IC are mounted;

(b) an array of lenses for condensing light emitted from the light emitting element;

(c) a metallic head cover which holds the array of lenses spaced a predetermined distance away from the light emitting element, said metallic head cover communicating with the circuit substrate to radiate heat from said circuit substrate; and

(d) mounting means for firmly holding said circuit substrate and said metallic head cover together.

2. An LED head as defined in claim 1, wherein said circuit substrate has a bottom face, and wherein said mounting means comprises a plurality of mounting members which engage the bottom face of said circuit substrate to bias said circuit substrate against said head cover.

5. An LED head as defined in any one of claims 1, 2, 3, and 4 wherein said mounting means is made of a metal material having a heat radiating property.

3. An LED head comprising:

(a) a circuit substrate on which a light emitting element and drive IC are mounted;

(b) an array of lenses for condensing emitted light from the light emitting element;

(c) a metallic head cover which holds the array of lenses spaced a predetermined distance away from the light emitting element, said metallic head cover communicating with the circuit substrate to radiate heat from said circuit substrate; and

(d) mounting means for firmly holding said circuit substrate and said metallic head cover together;

wherein said circuit substrate has a bottom face, and wherein said mounting means comprises a plurality of mounting members which engage the bottom face of said circuit substrate to bias said circuit substrate against said head cover; and

wherein each of said mounting members includes a stamped part adapted to engage at least a part of one side of said circuit substrate adjacent to said bottom side.

4. An LED head as defined in claim 3 wherein said metallic head cover comprises:

(c1) a horizontal section disposed to cover the surface of said circuit substrate;

(c2) a first vertical section extending upwardly from said horizontal section at one end; and

(c3) a second vertical section extending downwardly from said horizontal section at the other end, said second vertical section including its L-shaped tip end; and

wherein said mounting means is formed of a resilient material having a substantially V-shaped cross-section, said mounting means comprising;

(d1) an engagement portion which is one leg of the V engaging the bottom face of said circuit substrate;

(d2) an extension extending from said engagement portion and being adapted to engage said second vertical section; and

(d3) another engagement portion which is the other leg of the V engaging said first vertical section.