Leadless chip-type light emitting element

• US 5,298,768 A
• Filed: 12/30/1992
• Issued: 03/29/1994
• Est. Priority Date: 02/14/1992
• Status: Expired due to Term

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Okazaki, Jun, Katoh, Masaaki
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US07/998,746
• Time in Patent Office: 454 Days
• Field of Search: 257/99, 257/100, 257/91, 257/88, 257/98, 257/81, 257/82
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/351 Thermal stress
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting element having a cavity at the center of the top surface of an insulating block body. A through-hole extends downward through the block body to the bottom of the cavity. A metallic layer is present on the sides and bottom of the cavity, the sides of the through-hole, the bottom surface and part of the side surfaces of the block body. An LED chip is disposed on the metallic layer to the side of the bottom of the cavity. The LED chip and the metallic layer formed on a side of the bottom of the cavity separate from the first side are connected by a metallic wire. The cavity and the through-hole are filled with resin for encapsulating the LED chip.

Claims

1. A light emitting element comprising:

an insulating substrate having a cavity at the center of a top surface thereof and a through-hole formed in the bottom of said cavity, sides of said cavity slope outward toward the top surface, said through-hole extending downward through said insulating substrate to a bottom surface;

a first electrode which is formed to continuously cover a first side of said cavity, a first portion of said through-hole, a first portion of said bottom surface and a first side surface of said substrate, wherein the first electrode does not cover the entire portion of said first side surface;

a second electrode which is formed to continuously cover a second side of said cavity, a second portion of said through-hole, a second portion of the bottom surface and a second side surface of said substrate, said second side of said cavity facing said first side of said cavity, said second side surface of said substrate facing said first surface of said substrate, wherein the second electrode does not cover the entire portion of said second side surface;

light emitting means, electrically joined to said first electrode, for emitting light when electricity is conducted;

connecting means for electrically connecting said light emitting means to said second electrode; and

translucent sealing means for filling said cavity and said through hole.

2. The light emitting element according to claim 1, wherein said through-hole has sides which slope outward toward the bottom surface of the insulating substrate.

3. The light emitting element according to claim 1, wherein said insulating substrate is formed of a heat-resistant resin.

4. The light emitting element according to claim 1, wherein said first and second electrodes are formed by plating.

5. The light emitting element according to claim 1, wherein said light emitting means is a light emitting diode chip mounted to the bottom of said cavity with a conductive paste.

6. The light emitting element according to claim 1, wherein said connecting means is a metallic wire.

7. The light emitting element according to claim 1, wherein said sealing means is an epoxy resin.

8. The light emitting element according to claim 1, wherein a pair of through-holes are formed, one of said through-holes being respectively formed on the first and second sides of said cavity.

9. The light emitting element according to claim 8, wherein said insulating substrate has resist sections, said resist sections being formed by depositing a resist ink onto the top edge of said substrate and the bottom surface of said insulating substrate between said through holes.

10. The light emitting element according to claim 1, wherein the sides of said cavity slope outward toward the top surface of the insulating substrate at an angle of less than 90°

with respect to the bottom of the cavity for reflecting light emitted from said light emitting element toward the top surface of said insulating substrate through said translucent sealing means.

11. The light emitting element according to claim 10, wherein the sides of the through-hole slope in a direction outward toward the bottom of the insulating substrate at an angle of less than 90°

for stabilizing the internal forces within the translucent sealing means which fills the cavity and the through-hole.

12. The light emitting element according to claim 1, wherein the first side surface includes a first recessed portion extending along a portion of said first side surface for receiving the first electrode so that the first electrode does not extend along the entire length of the first side surface;

and

the second side surface includes a recessed portion extending along a portion of said second side surface for receiving the second electrode so that the second electrode does not extend along the entire length of the second side surface.

13. The light emitting element according to claim 8, wherein said through-hole has sides which slope outward toward the bottom surface of the insulating substrate.

14. The light emitting element according to claim 8, wherein said substrate is formed of a heat-resistant resin.

15. The light emitting element according to claim 8, wherein said first and second electrodes are formed by plating.

16. The light emitting element according to claim 8, wherein said light emitting means is a light emitting diode chip mounted to the bottom of said cavity with a conductive paste.

17. The light emitting element according to claim 8, wherein said connecting means is a metallic wire.

18. The light emitting element according to claim 8, wherein said sealing means is an epoxy resin.

19. The light emitting element according to claim 8, wherein the sides of said cavity slope outward toward the top surface of the insulating substrate at an angle of less than 90°

with respect to the bottom of the cavity for reflecting light emitted from said light emitting element toward the top surface of said insulating substrate through said translucent sealing means.

20. The light emitting element according to claim 11, wherein the sides of the through-hole slope in a direction outward toward the bottom of the insulating substrate at an angle of less than 90°

for stabilizing the internal forces within the translucent sealing means which fills the cavity and the through-hole.

21. The light emitting element according to claim 20, wherein the first side surface includes a first recessed portion extending along a portion of said first side surface for receiving the first electrode so that the first electrode does not extend along the entire length of the first side surface;

and

the second side surface includes a recessed portion extending along a portion of said second side surface for receiving the second electrode so that the second electrode does not extend along the entire length of the second side surface.

22. The light emitting element according to claim 8, wherein said first electrode reaches from said first side of said cavity to said first side surface of said substrate through one of said through-holes, and said second electrode reaches from said second side of said cavity to said second side surface of said substrate through the other through-hole.

23. The light emitting element according to claim 8, wherein said first electrode is further formed to continuously cover a first part of said bottom of said cavity, said second electrode is further formed to continuously cover a second part of said bottom of said cavity, said first part and said second part are electrically insulated with each other and located between one of said through-holes and the other through-hole, said light emitting means is electrically joined to said first electrode at said first part, and said connecting means electrically connects said light emitting means to said second electrode at said second part.